羟基 马来酰亚胺检测标准
CNAS认证
CMA认证
GB/T 1303.10-2009
电气用热固性树脂工业硬质层压板 第10部分：双马来酰亚胺树脂硬质层压板
Industrial rigid laminated sheets based on thermosetting resins for electrical purposes - Part 10: Requirements for rigid laminated sheets based on bis-maleimide resins
- 【发布单位或类别】 CN-GB国家标准
- 【发布日期】2009-06-10
- 【CCS分类】K15电工绝缘材料及其制品
- 【ICS分类】29.035.01绝缘材料综合
GB/T 1303.10-2009
集成电路用双马来酰亚胺/三嗪（BT）封装基材
Bismaleimide/ triazine (BT) base material for Integrated circuit (IC) package
- 【发布单位或类别】 CN-PLAN国家标准计划
- 【发布日期】2023-12-28
- 【CCS分类】
- 【ICS分类】31.030电子技术专用材料
GB/T 1303.10-2009
Bismaleimide Tooling For 350f Application
Bismaleimide Tooling For 350f Application
- 【发布单位或类别】 JP-SM日本船用装置工业会
- 【发布日期】1991-06-01
- 【CCS分类】
- 【ICS分类】印制电路和印制电路板
GB/T 1303.10-2009
Aerospace; preimpregnated unidirectional sheet of carbon fibres and bismaleinimide- or polyimide resin; technical specification
Aerospace; preimpregnated unidirectional sheet of carbon fibres and bismaleinimide- or polyimide resin; technical specification
- 【发布单位或类别】 DE-DIN德国标准化学会
- 【发布日期】1993-02-01
- 【CCS分类】
- 【ICS分类】印制电路和印制电路板
GB/T 1303.10-2009
Prepreg for multilayer printed wiring boards -- Bismaleimide/Triazine/Epoxide resin-Impregnated glass Cloth
Prepreg for multilayer printed wiring boards -- Bismaleimide/Triazine/Epoxide resin-Impregnated glass Cloth
- 【发布单位或类别】 JP-JSA日本工业标准调查会
- 【发布日期】1995-01-01
- 【CCS分类】
- 【ICS分类】印制电路和印制电路板
GB/T 1303.10-2009
Base materials for printed circuits -- Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
Base materials for printed circuits -- Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
- 【发布单位或类别】 JP-JSA日本工业标准调查会
- 【发布日期】1998-01-01
- 【CCS分类】
- 【ICS分类】印制电路和印制电路板
GB/T 1303.10-2009
Base materials for printed circuits -- Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
Base materials for printed circuits -- Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
- 【发布单位或类别】 JP-JSA日本工业标准调查会
- 【发布日期】1999-01-01
- 【CCS分类】
- 【ICS分类】印制电路和印制电路板
GB/T 1303.10-2009
인쇄회로기판 및 기타 전자배선용 재료－제2-9부：동박적층 난연등급(수직연소 시험)의 유리섬유 직조 비스말레이미드/트리아진 변형 또는 무변형 에폭시 동박적층판 및 무동박적층판
Materials for printed boards and other interconnecting structures－Part 2-9：Reinforced base materials clad and unclad－Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
- 【发布单位或类别】 KR-KS韩国标准
- 【发布日期】2011-07-28
- 【CCS分类】
- 【ICS分类】31.180
GB/T 1303.10-2009
프린트 배선판용 동입힘 적층판 - 유리천 바탕 비스마레이미드/트리아진/에폭시 수지
COPPER-CLAD LAMINATES FOR PRINTED WIRING BOARDS-GLASS FABRIC BASE, BISMALEIMIDE/TRIAZINE/EPOXIDE
- 【发布单位或类别】 KR-KS韩国标准
- 【发布日期】1995-01-05
- 【CCS分类】
- 【ICS分类】31.180
GB/T 1303.10-2009
SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEIMIDE MODIFIED EPOXY RESIN) (SUPERSEDING MIL-S-13949/26) (NO S/S DOCUMENT)
SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEIMIDE MODIFIED EPOXY RESIN) (SUPERSEDING MIL-S-13949/26) (NO S/S DOCUMENT)
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】1997-08-01
- 【CCS分类】
- 【ICS分类】
GB/T 1303.10-2009
SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEIMIDE MODIFIED EPOXY RESIN) (SUPERSEDING MIL-S-13949/26) (NO S/S DOCUMENT)
SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEIMIDE MODIFIED EPOXY RESIN) (SUPERSEDING MIL-S-13949/26) (NO S/S DOCUMENT)
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】1993-04-11
- 【CCS分类】
- 【ICS分类】
GB/T 1303.10-2009
다층 프린트 배선판용 프르프레그 - 유리천 바탕재 비스마레이미드/트리아진/에폭시 수지
PREPREG FOR MULTILAYER PRINTED WIRING BOARDS - BISMALEIMIDE/TRIAZINE/EPOXIDE RESIN - IMPREGNATED GLASS CLOTH
- 【发布单位或类别】 KR-KS韩国标准
- 【发布日期】1997-10-20
- 【CCS分类】
- 【ICS分类】31.180
GB/T 1303.10-2009
Specifications-Specification No. 19. Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
Specifications-Specification No. 19. Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
- 【发布单位或类别】 GB-BSI英国标准学会
- 【发布日期】1992-09-15
- 【CCS分类】
- 【ICS分类】
GB/T 1303.10-2009
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICTION Nº 18: BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICTION Nº 18: BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).
- 【发布单位或类别】 ES-UNE西班牙标准
- 【发布日期】1997-10-17
- 【CCS分类】
- 【ICS分类】
GB/T 1303.10-2009
Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
- 【发布单位或类别】 IX-IEC国际电工委员会
- 【发布日期】2012-11-29
- 【CCS分类】
- 【ICS分类】31.180
GB/T 1303.10-2009
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
- 【发布单位或类别】 ES-UNE西班牙标准
- 【发布日期】1997-08-11
- 【CCS分类】
- 【ICS分类】
GB/T 1303.10-2009
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
- 【发布单位或类别】 ES-UNE西班牙标准
- 【发布日期】1997-10-17
- 【CCS分类】
- 【ICS分类】
GB/T 1303.10-2009
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
- 【发布单位或类别】 ES-UNE西班牙标准
- 【发布日期】1997-10-17
- 【CCS分类】
- 【ICS分类】
GB/T 1303.10-2009
SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEMIDE MODIFIED EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/24) (NO S/S DOCUMENT)
SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEMIDE MODIFIED EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/24) (NO S/S DOCUMENT)
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】1993-04-11
- 【CCS分类】
- 【ICS分类】
GB/T 1303.10-2009
인쇄회로기판 및 기타 전자배선용 재료－제2-9부：동박적층 난연등급(수직연소 시험)의 유리섬유 직조 비스말레이미드/트리아진 변형 또는 무변형 에폭시 동박적층판 및 무동박적층판
Materials for printed boards and other interconnecting structures－Part 2-9：Reinforced base materials clad and unclad－Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
- 【发布单位或类别】 KR-KS韩国标准
- 【发布日期】2011-07-28
- 【CCS分类】
- 【ICS分类】31.180
