GB/T 1303.10-2009
Industrial rigid laminated sheets based on thermosetting resins for electrical purposes - Part 10: Requirements for rigid laminated sheets based on bis-maleimide resins
GB/T 1303.10-2009
Bismaleimide/ triazine (BT) base material for Integrated circuit (IC) package
GB/T 1303.10-2009
Bismaleimide Tooling For 350f Application
GB/T 1303.10-2009
Aerospace; preimpregnated unidirectional sheet of carbon fibres and bismaleinimide- or polyimide resin; technical specification
GB/T 1303.10-2009
Prepreg for multilayer printed wiring boards -- Bismaleimide/Triazine/Epoxide resin-Impregnated glass Cloth
GB/T 1303.10-2009
Base materials for printed circuits -- Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
GB/T 1303.10-2009
Base materials for printed circuits -- Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
GB/T 1303.10-2009
Materials for printed boards and other interconnecting structures-Part 2-9:Reinforced base materials clad and unclad-Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
GB/T 1303.10-2009
COPPER-CLAD LAMINATES FOR PRINTED WIRING BOARDS-GLASS FABRIC BASE, BISMALEIMIDE/TRIAZINE/EPOXIDE
GB/T 1303.10-2009
SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEIMIDE MODIFIED EPOXY RESIN) (SUPERSEDING MIL-S-13949/26) (NO S/S DOCUMENT)
GB/T 1303.10-2009
SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEIMIDE MODIFIED EPOXY RESIN) (SUPERSEDING MIL-S-13949/26) (NO S/S DOCUMENT)
GB/T 1303.10-2009
PREPREG FOR MULTILAYER PRINTED WIRING BOARDS - BISMALEIMIDE/TRIAZINE/EPOXIDE RESIN - IMPREGNATED GLASS CLOTH
GB/T 1303.10-2009
Specifications-Specification No. 19. Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
GB/T 1303.10-2009
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICTION Nº 18: BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).
GB/T 1303.10-2009
Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
GB/T 1303.10-2009
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
GB/T 1303.10-2009
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
GB/T 1303.10-2009
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
GB/T 1303.10-2009
SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEMIDE MODIFIED EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/24) (NO S/S DOCUMENT)
GB/T 1303.10-2009
Materials for printed boards and other interconnecting structures-Part 2-9:Reinforced base materials clad and unclad-Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad