环氧树脂灌胶机检测标准，环氧树脂灌胶机检测标准标准内容,检测中心-北检（北京）检测技术研究院

GB/T 36797-2018

装修防开裂用环氧树脂接缝胶
Epoxy resin joint sealant for anti-cracking in refurbishment

【发布单位或类别】 CN-GB国家标准
【发布日期】2018-09-17
【CCS分类】G39胶粘剂
【ICS分类】83.180粘合剂和胶粘产品

T/SZIEIA 04-2024

灌胶机

【发布单位或类别】 CN-TUANTI团体标准
【发布日期】2024-05-28
【CCS分类】K电工
【ICS分类】工业机器人、机械手

T/QGCML 777-2023

精准注胶系统灌胶机

【发布单位或类别】 CN-TUANTI团体标准
【发布日期】2023-04-25
【CCS分类】
【ICS分类】25.040.30有关制药学的其他标准

T/HZBX 063-2023

环氧树脂AB胶制作植物类中药饮片标本技术规程

【发布单位或类别】 CN-TUANTI团体标准
【发布日期】2023-06-30
【CCS分类】
【ICS分类】11.120.99

SAE AMS3734B

Potting Compound, Epoxy, Unfilled General Purpose Room Temperature Cure
Potting Compound, Epoxy, Unfilled General Purpose Room Temperature Cure

【发布单位或类别】 US-SAE美国机动车工程师协会
【发布日期】1996-06-01
【CCS分类】
【ICS分类】

SAE AMS3730

Potting Compound, Foamed Epoxy Type, Amine Hardened
Potting Compound, Foamed Epoxy Type, Amine Hardened

【发布单位或类别】 US-SAE美国机动车工程师协会
【发布日期】1991-10-15
【CCS分类】
【ICS分类】

SAE AMS3735C

Potting Compound, Epoxy, Filled 10 - 15 Cte, 225 Hdt
Potting Compound, Epoxy, Filled 10 - 15 Cte, 225 Hdt

【发布单位或类别】 US-SAE美国机动车工程师协会
【发布日期】1996-06-01
【CCS分类】
【ICS分类】

SAE AMS3738B

Potting Compound, Epoxy, Filled 15 - 20 Cte, 180 Hdt
Potting Compound, Epoxy, Filled 15 - 20 Cte, 180 Hdt

【发布单位或类别】 US-SAE美国机动车工程师协会
【发布日期】1994-12-01
【CCS分类】
【ICS分类】

SAE AMS3732B

Potting Compound, Epoxy One Part, Filled, Heat Cure, Low CTE (Stabilized: May 2015)
Potting Compound, Epoxy One Part, Filled, Heat Cure, Low CTE (Stabilized: May 2015)

【发布单位或类别】 US-SAE美国机动车工程师协会
【发布日期】2015-05-13
【CCS分类】
【ICS分类】

SAE AMS3736B

Potting Compound, Epoxy, Filled 25 - 30 Cte, 175 Hdt Room Temperature Cure
Potting Compound, Epoxy, Filled 25 - 30 Cte, 175 Hdt Room Temperature Cure

【发布单位或类别】 US-SAE美国机动车工程师协会
【发布日期】1996-06-01
【CCS分类】
【ICS分类】

SAE AMS3740B

Potting Compound, Epoxy, Filled 15 - 20 Cte, 225 Hdt Free Machining
Potting Compound, Epoxy, Filled 15 - 20 Cte, 225 Hdt Free Machining

【发布单位或类别】 US-SAE美国机动车工程师协会
【发布日期】1994-12-01
【CCS分类】
【ICS分类】

SAE AMS3739A

Potting Compound, Epoxy Filled, 9-1 Cte, 250 Hdt
Potting Compound, Epoxy Filled, 9-1 Cte, 250 Hdt

【发布单位或类别】 US-SAE美国机动车工程师协会
【发布日期】1988-04-01
【CCS分类】
【ICS分类】

SAE AMS3737B

Potting Compound, Epoxy, Unfilled 35 - 40 Cte, 160 Hdt Room Temperature Cure
Potting Compound, Epoxy, Unfilled 35 - 40 Cte, 160 Hdt Room Temperature Cure

【发布单位或类别】 US-SAE美国机动车工程师协会
【发布日期】1996-06-01
【CCS分类】
【ICS分类】

MIL MIL-I-46865B

INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)
INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)

【发布单位或类别】 US-MIL美国军事规范和标准
【发布日期】1991-06-28
【CCS分类】
【ICS分类】

MIL MIL-I-46865B Notice 3-Cancellation

INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)
INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)

【发布单位或类别】 US-MIL美国军事规范和标准
【发布日期】1997-11-24
【CCS分类】
【ICS分类】

MIL MIL-I-46865B Notice 2-Reactivation

INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)
INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)

【发布单位或类别】 US-MIL美国军事规范和标准
【发布日期】1997-03-12
【CCS分类】
【ICS分类】

SAE AMS3675A

Potting Compound, Foamed Epoxy Type, Amine Hardened
Potting Compound, Foamed Epoxy Type, Amine Hardened

【发布单位或类别】 US-SAE美国机动车工程师协会
【发布日期】1956-07-01
【CCS分类】
【ICS分类】

SAE AMS3732A

Potting Compound, Epoxy One Part, Filled, Heat Cure, Low Cte (Noncurrent: Jan 1993)
Potting Compound, Epoxy One Part, Filled, Heat Cure, Low Cte (Noncurrent: Jan 1993)

【发布单位或类别】 US-SAE美国机动车工程师协会
【发布日期】1993-01-01
【CCS分类】
【ICS分类】

SAE AMS3733B

Potting Compound, Epoxy, Two Part, Highly Filled, Heat Cure, High Compressive Strength (Noncurrent: Jan 1993)
Potting Compound, Epoxy, Two Part, Highly Filled, Heat Cure, High Compressive Strength (Noncurrent: Jan 1993)

【发布单位或类别】 US-SAE美国机动车工程师协会
【发布日期】1993-01-01
【CCS分类】
【ICS分类】

环氧树脂灌胶机检测标准

装修防开裂用环氧树脂接缝胶 Epoxy resin joint sealant for anti-cracking in refurbishment

灌胶机

精准注胶系统灌胶机

环氧树脂AB胶制作植物类中药饮片标本技术规程

Potting Compound, Epoxy, Unfilled General Purpose Room Temperature Cure Potting Compound, Epoxy, Unfilled General Purpose Room Temperature Cure

Potting Compound, Foamed Epoxy Type, Amine Hardened Potting Compound, Foamed Epoxy Type, Amine Hardened

Potting Compound, Epoxy, Filled 10 - 15 Cte, 225 Hdt Potting Compound, Epoxy, Filled 10 - 15 Cte, 225 Hdt

Potting Compound, Epoxy, Filled 15 - 20 Cte, 180 Hdt Potting Compound, Epoxy, Filled 15 - 20 Cte, 180 Hdt

Potting Compound, Epoxy One Part, Filled, Heat Cure, Low CTE (Stabilized: May 2015) Potting Compound, Epoxy One Part, Filled, Heat Cure, Low CTE (Stabilized: May 2015)

Potting Compound, Epoxy, Filled 25 - 30 Cte, 175 Hdt Room Temperature Cure Potting Compound, Epoxy, Filled 25 - 30 Cte, 175 Hdt Room Temperature Cure

Potting Compound, Epoxy, Filled 15 - 20 Cte, 225 Hdt Free Machining Potting Compound, Epoxy, Filled 15 - 20 Cte, 225 Hdt Free Machining

Potting Compound, Epoxy Filled, 9-1 Cte, 250 Hdt Potting Compound, Epoxy Filled, 9-1 Cte, 250 Hdt

Potting Compound, Epoxy, Unfilled 35 - 40 Cte, 160 Hdt Room Temperature Cure Potting Compound, Epoxy, Unfilled 35 - 40 Cte, 160 Hdt Room Temperature Cure

INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A) INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)

INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A) INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)

INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A) INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)

Potting Compound, Foamed Epoxy Type, Amine Hardened Potting Compound, Foamed Epoxy Type, Amine Hardened

Potting Compound, Epoxy One Part, Filled, Heat Cure, Low Cte (Noncurrent: Jan 1993) Potting Compound, Epoxy One Part, Filled, Heat Cure, Low Cte (Noncurrent: Jan 1993)

Potting Compound, Epoxy, Two Part, Highly Filled, Heat Cure, High Compressive Strength (Noncurrent: Jan 1993) Potting Compound, Epoxy, Two Part, Highly Filled, Heat Cure, High Compressive Strength (Noncurrent: Jan 1993)

北检院部分仪器展示

装修防开裂用环氧树脂接缝胶
Epoxy resin joint sealant for anti-cracking in refurbishment

Potting Compound, Epoxy, Unfilled General Purpose Room Temperature Cure
Potting Compound, Epoxy, Unfilled General Purpose Room Temperature Cure

Potting Compound, Foamed Epoxy Type, Amine Hardened
Potting Compound, Foamed Epoxy Type, Amine Hardened

Potting Compound, Epoxy, Filled 10 - 15 Cte, 225 Hdt
Potting Compound, Epoxy, Filled 10 - 15 Cte, 225 Hdt

Potting Compound, Epoxy, Filled 15 - 20 Cte, 180 Hdt
Potting Compound, Epoxy, Filled 15 - 20 Cte, 180 Hdt

Potting Compound, Epoxy One Part, Filled, Heat Cure, Low CTE (Stabilized: May 2015)
Potting Compound, Epoxy One Part, Filled, Heat Cure, Low CTE (Stabilized: May 2015)

Potting Compound, Epoxy, Filled 25 - 30 Cte, 175 Hdt Room Temperature Cure
Potting Compound, Epoxy, Filled 25 - 30 Cte, 175 Hdt Room Temperature Cure

Potting Compound, Epoxy, Filled 15 - 20 Cte, 225 Hdt Free Machining
Potting Compound, Epoxy, Filled 15 - 20 Cte, 225 Hdt Free Machining

Potting Compound, Epoxy Filled, 9-1 Cte, 250 Hdt
Potting Compound, Epoxy Filled, 9-1 Cte, 250 Hdt

Potting Compound, Epoxy, Unfilled 35 - 40 Cte, 160 Hdt Room Temperature Cure
Potting Compound, Epoxy, Unfilled 35 - 40 Cte, 160 Hdt Room Temperature Cure

INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)
INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)

INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)
INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)

INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)
INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)

Potting Compound, Foamed Epoxy Type, Amine Hardened
Potting Compound, Foamed Epoxy Type, Amine Hardened

Potting Compound, Epoxy One Part, Filled, Heat Cure, Low Cte (Noncurrent: Jan 1993)
Potting Compound, Epoxy One Part, Filled, Heat Cure, Low Cte (Noncurrent: Jan 1993)

Potting Compound, Epoxy, Two Part, Highly Filled, Heat Cure, High Compressive Strength (Noncurrent: Jan 1993)
Potting Compound, Epoxy, Two Part, Highly Filled, Heat Cure, High Compressive Strength (Noncurrent: Jan 1993)