HG/T 6276-2024
GB/T 13657-2011
Bisphenol-A epoxy resin
GB/T 27809-2011
Bisphenol A epoxy resins for thermosetting powder coatings
GB/T 13657-1992
Bisphenol—A epoxy resins
SN/T 3351-2012
GB 31604.54-2023
DB13/T 2590-2017
SN/T 3150-2012
Determination of bisphenol diglycidyl ether residues in food for export-LC-MS/MS method
SN/T 2379-2009
Determination of bisphenol A in polycarbonate resin and its products-Gas chromatography-mass spectrography
ASTM A1055/A1055M-22
Standard Specification for Zinc and Epoxy Dual-Coated Steel Reinforcing Bars
MIL MIL-I-24768/27 Notice 1-Validation 1
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, GLASS-CLOTH, EPOXY-RESIN (GEE-F)
MIL MIL-I-24768/28 Notice 1-Validation 1
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, GLASS-CLOTH, EPOXY-RESIN (GEB-F)
SAE AMS3699A
Resin System, Epoxy, Carbon Microballoon Filled, 135 °C (275 °F) Cure
SAE AMS3695/2
Adhesive Film, Epoxy-Base, High Durability For 120 °C (250 °F) Service
MIL MIL-I-24768/27
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, GLASS-CLOTH, EPOXY-RESIN (GEE-F)
MIL MIL-I-24768/28
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, GLASS-CLOTH, EPOXY-RESIN (GEB-F)
SAE AMS3731/4C
Potting Compound, Epoxy Bisphenol A-Type Impregnating Resin, Heat Cure, Single Component
SAE AMS3960A
Advanced Composites Prepreg - Nominal 250 °F Cure - Carbon Fiber and Epoxy Resin, Unidirectional Tape
SAE AMS3672C
Plastic Molding Compound, Epi-Bis Epoxy, Glass Fiber Reinforced, Structural
MIL MIL-I-24768/27 Amendment 1
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, GLASS-CLOTH, EPOXY-RESIN (GEE-F)