环氧树脂板加工检测标准
CNAS认证
CMA认证
HDB/YD 037-2016
印制电路用覆铜箔层压板（玻璃纤维布基、环氧树脂基）加工贸易单耗标准
- 【发布单位或类别】 UNKNOWN其他未分类
- 【发布日期】2016-07-25
- 【CCS分类】
- 【ICS分类】印制电路和印制电路板
DIN EN 61249-2-8
Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials, clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad (IEC 61249-2-8:2003); German version EN 61249-2-8:2003
Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials, clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad (IEC 61249-2-8:2003); German version EN 61249-2-8:2003
- 【发布单位或类别】 DE-DIN德国标准化学会
- 【发布日期】2004-01-01
- 【CCS分类】
- 【ICS分类】印制电路和印制电路板
KS C 6458-1997(2017)
다층 프린트 배선판용 프리프레그 (유리천 바탕재 에폭시 수지)
Prepreg for multilayer printed wiring boards (Epoxy resin-Impregnated glass cloth)
- 【发布单位或类别】 KR-KS韩国标准
- 【发布日期】1997-08-19
- 【CCS分类】
- 【ICS分类】31.180印制电路和印制电路板
KS C 6458-1997(2022)
다층 프린트 배선판용 프리프레그 (유리천 바탕재 에폭시 수지)
Prepreg for multilayer printed wiring boards (Epoxy resin-Impregnated glass cloth)
- 【发布单位或类别】 KR-KS韩国标准
- 【发布日期】1997-08-19
- 【CCS分类】
- 【ICS分类】31.180印制电路和印制电路板
HDB/SH 047-2011
初级形态环氧树脂加工贸易单耗标准
- 【发布单位或类别】 UNKNOWN其他未分类
- 【发布日期】2011-05-17
- 【CCS分类】
- 【ICS分类】印制电路和印制电路板
JIS C 6482:1997
Copper-clad laminates for printed wiring boards -- Paper base, epoxy resin
Copper-clad laminates for printed wiring boards -- Paper base, epoxy resin
- 【发布单位或类别】 JP-JSA日本工业标准调查会
- 【发布日期】1997-01-01
- 【CCS分类】
- 【ICS分类】印制电路和印制电路板
JIS C 6522:1996
Prepreg for multilayer printed wiring boards -- Epoxy resin-impregnated glass cloth
Prepreg for multilayer printed wiring boards -- Epoxy resin-impregnated glass cloth
- 【发布单位或类别】 JP-JSA日本工业标准调查会
- 【发布日期】1996-01-01
- 【CCS分类】
- 【ICS分类】印制电路和印制电路板
SAE AMS3601E
Plastic Sheet, Copper Faced Glass Fabric Reinforced Epoxy Resin Hot Strength Retention (Stabilized: Aug 2011)
Plastic Sheet, Copper Faced Glass Fabric Reinforced Epoxy Resin Hot Strength Retention (Stabilized: Aug 2011)
- 【发布单位或类别】 US-SAE美国机动车工程师协会
- 【发布日期】2011-08-25
- 【CCS分类】
- 【ICS分类】
JIS C 6483:1997
Copper-clad laminates for printed wiring boards -- Synthetic fiber fabric base, epoxy resin
Copper-clad laminates for printed wiring boards -- Synthetic fiber fabric base, epoxy resin
- 【发布单位或类别】 JP-JSA日本工业标准调查会
- 【发布日期】1997-01-01
- 【CCS分类】
- 【ICS分类】
SAE AMS3599B
Plastic Sheet, Copper Faced Glass Fabric Reinforced Epoxy Resin, Flammability Controlled (Stabilized: Aug 2011)
Plastic Sheet, Copper Faced Glass Fabric Reinforced Epoxy Resin, Flammability Controlled (Stabilized: Aug 2011)
- 【发布单位或类别】 US-SAE美国机动车工程师协会
- 【发布日期】2011-08-25
- 【CCS分类】
- 【ICS分类】
KS C 6484-1996(2001)
프린트 배선판용 동입힘 적층판 (종이 바탕 에폭시수지)
COPPER-CLAD LAMINATES FOR PRINTED WIRING BOARDS (PAPER BASE, EPOXY RESIN)
- 【发布单位或类别】 KR-KS韩国标准
- 【发布日期】1996-12-30
- 【CCS分类】
- 【ICS分类】31.180
JIS C 6524:1995
Prepreg for multilayer printed wiring boards -- Bismaleimide/Triazine/Epoxide resin-Impregnated glass Cloth
Prepreg for multilayer printed wiring boards -- Bismaleimide/Triazine/Epoxide resin-Impregnated glass Cloth
- 【发布单位或类别】 JP-JSA日本工业标准调查会
- 【发布日期】1995-01-01
- 【CCS分类】
- 【ICS分类】
SAE AMS3740B
Potting Compound, Epoxy, Filled 15 - 20 Cte, 225 Hdt Free Machining
Potting Compound, Epoxy, Filled 15 - 20 Cte, 225 Hdt Free Machining
- 【发布单位或类别】 US-SAE美国机动车工程师协会
- 【发布日期】1994-12-01
- 【CCS分类】
- 【ICS分类】
QPL QPL-18177-105 Notice 1-Cancellation
PLASTIC SHEET, LAMINATED, THERMOSETTING, GLASS FIBER BASE, EPOXY-RESIN (NO S/S DOCUMENT) (SUPERSEDING QPL-18177-104)
PLASTIC SHEET, LAMINATED, THERMOSETTING, GLASS FIBER BASE, EPOXY-RESIN (NO S/S DOCUMENT) (SUPERSEDING QPL-18177-104)
- 【发布单位或类别】 UNKNOWN其他未分类
- 【发布日期】1992-04-16
- 【CCS分类】
- 【ICS分类】
IEC 61249-2-39:2012
Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
- 【发布单位或类别】 IX-IEC国际电工委员会
- 【发布日期】2012-11-29
- 【CCS分类】
- 【ICS分类】31.180
KS C 6486-1996(2001)
프린트 배선판용 동입힘 적층판 (합성 섬유 천 바탕 에폭시 수지)
COPPER-CLAD LAMINATES FOR PRINTED WIRING BOARDS (SYNTHETIC FIBER FABRIC BASE, EPOXY RESIN)
- 【发布单位或类别】 KR-KS韩国标准
- 【发布日期】1996-12-30
- 【CCS分类】
- 【ICS分类】31.180
KS C 6475-1996(2001)
프린트 배선판용 동입힘 적층판 (유리천·종이 복합 바탕재 에폭시 수지)
COPPER-CLAD LAMINATES FOR PRINTED WIRING BOARDS - GLASS CLOTH SURFACES, CELLULOSE PAPER CORE, EPOXY RESIN
- 【发布单位或类别】 KR-KS韩国标准
- 【发布日期】1996-12-30
- 【CCS分类】
- 【ICS分类】31.180
KS C 6483-1996(2001)
프린트 배선판용 동입힘 적층판 (유리천 바탕 에폭시 수지)
COPPER-CLAD LAMINATES FOR PRINTED WIRING BOARDS (GLASS FABRIC BASE EPOXY RESIN)
- 【发布单位或类别】 KR-KS韩国标准
- 【发布日期】1996-12-30
- 【CCS分类】
- 【ICS分类】31.180
MIL MIL-S-13949/16B Notice 2-Cancellation
SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/16A) (NO S/S DOCUMENT)
SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/16A) (NO S/S DOCUMENT)
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】1998-11-30
- 【CCS分类】
- 【ICS分类】
MIL MIL-S-13949/16B Notice 1-Inactivation
SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/16A) (NO S/S DOCUMENT)
SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL AF (WOVEN ARAMID REINFORCEMENT, EPOXY RESIN, FLAME RESISTANT) (SUPERSEDING MIL-S-13949/16A) (NO S/S DOCUMENT)
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】1997-08-01
- 【CCS分类】
- 【ICS分类】
