SAE ARP5256A
Mixing Resins, Adhesives and Potting Compounds (Stabilized: Feb 2022)
SAE AMS3731/4C
Potting Compound, Epoxy Bisphenol A-Type Impregnating Resin, Heat Cure, Single Component
SAE AMS3730
Potting Compound, Foamed Epoxy Type, Amine Hardened
SAE AMS3734B
Potting Compound, Epoxy, Unfilled General Purpose Room Temperature Cure
SAE AMS3735C
Potting Compound, Epoxy, Filled 10 - 15 Cte, 225 Hdt
SAE AMS3738B
Potting Compound, Epoxy, Filled 15 - 20 Cte, 180 Hdt
SAE AMS3732B
Potting Compound, Epoxy One Part, Filled, Heat Cure, Low CTE (Stabilized: May 2015)
SAE AMS3736B
Potting Compound, Epoxy, Filled 25 - 30 Cte, 175 Hdt Room Temperature Cure
SAE ARP5256
MIXING RESINS, ADHESIVES AND POTTING COMPOUNDS
SAE AMS3739A
Potting Compound, Epoxy Filled, 9-1 Cte, 250 Hdt
SAE AMS3740B
Potting Compound, Epoxy, Filled 15 - 20 Cte, 225 Hdt Free Machining
SAE AMS3737B
Potting Compound, Epoxy, Unfilled 35 - 40 Cte, 160 Hdt Room Temperature Cure
HG/T 5606-2019
MIL MIL-I-46865B
INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)
JB/T 20160-2013
Syringe filling-sealing machine
MIL MIL-I-46865B Notice 3-Cancellation
INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)
MIL MIL-I-46865B Notice 2-Reactivation
INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)
HG/T 5053-2016
Potting sealants of silicone
SAE AMS3675A
Potting Compound, Foamed Epoxy Type, Amine Hardened
JB/T 20002.1-2011
Ampoule cleaning-drying and filling-sealing production line