树脂 电镀检测标准
CNAS认证
CMA认证
MIL MIL-PRF-31032/2D
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2020-03-02
- 【CCS分类】重金属及其合金
- 【ICS分类】镍和铬产品
MIL MIL-PRF-31032/6C
Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2020-05-06
- 【CCS分类】室外给水、排水工程
- 【ICS分类】工业用水
MIL MIL-PRF-31032/5C
Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications
Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2020-05-05
- 【CCS分类】材料防护
- 【ICS分类】金属镀层
MIL MIL-PRF-31032/2C Amendment 1
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2018-06-12
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/1D
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2017-06-01
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/2A Amendment 4(all prev amd incorp.)
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2009-07-04
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/1C Amendment 1(amendment incorporated)
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2012-11-01
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/2B Amendment 1(amendment incorporated)
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2012-11-02
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/2A Amendment 3
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-Through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-Through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2008-04-23
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/2A Amendment 2
PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/2)
PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/2)
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2006-10-31
- 【CCS分类】
- 【ICS分类】
YS/T 1643-2023
电镀专用镍
- 【发布单位或类别】 CN-YS行业标准-有色金属
- 【发布日期】2023-12-20
- 【CCS分类】H62
- 【ICS分类】77.150.40
HB/Z 5068-1992
电镀锌,电镀镉工艺
- 【发布单位或类别】 CN-HB行业标准-航空
- 【发布日期】1992-04-15
- 【CCS分类】
- 【ICS分类】
DB13/T 2712-2018
取水定额 电镀行业
- 【发布单位或类别】 CN-DB13河北省地方标准
- 【发布日期】2018-04-09
- 【CCS分类】P41
- 【ICS分类】13.060.25
GB/T 9800-1988
电镀锌和电镀镉层的铬酸盐转化膜
Chromate conversion coatings on electroplated zinc and cadmium coatings
- 【发布单位或类别】 CN-GB国家标准
- 【发布日期】1988-09-05
- 【CCS分类】A29
- 【ICS分类】25.220.40
MIL MIL-PRF-31032/6B
Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2017-10-06
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/2C
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2017-06-02
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/6A
Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2012-12-11
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/5B
Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications
Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2017-10-05
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/2B
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2010-06-14
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/6
Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2008-03-11
- 【CCS分类】
- 【ICS分类】
