SAE AMS3690D
Adhesive Compound, Epoxy Room Temperature Curing
SAE AMS3731/1C
Potting Compound, Epoxy Bisphenol A-Type Unfilled, Room Temperature Cure
SAE AMS3731/5C
Potting Compound, Epoxy Bisphenol A-Type Filled, Room Temperature Cure, Low Exotherm
SAE AMS3731/7C
Potting Compound, Epoxy Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage
SAE AMS3731/10C
Potting Compound, Epoxy, Bisphenol A-Type, Unfilled, Room Temperature Cure, Semiflexible
SAE AMS3690C
Adhesive Compound, Epoxy, Room Temperature Curing
SAE AMS3736B
Potting Compound, Epoxy, Filled 25 - 30 Cte, 175 Hdt Room Temperature Cure
SAE AMS3737B
Potting Compound, Epoxy, Unfilled 35 - 40 Cte, 160 Hdt Room Temperature Cure
SAE AMS3690B
Adhesive Compound, Epoxy, Room Temperature Curing
SAE AMS3690A
Adhesive Compound, Epoxy, Room Temperature Curing
SAE AMS3731/1B
Potting Compound, Epoxy, Bisphenol A-Type, Unfilled, Room Temperature Cure
SAE AMS3731/1A
Potting Compound, Epoxy, Bisphenol A-Type, Unfilled, Room Temperature Cure
SAE AMS3736
Potting Compound, Epoxy, Filled 25 - 30 Cte, 175 Hdt Roomtemperature Cure
SAE AMS3731/5B
Potting Compound, Epoxy, Bisphenol A-Type, Filled, Room Temperature Cure, Low Exotherm
SAE AMS3737
Potting Compound, Epoxy, Unfilled 35-40 Cte, 160 Hdt Roomtemperature Cure
SAE AMS3731/7B
Potting Compound, Epoxy, Bisphenol A-Type, Filled, Room Temperature Cure, Low Shrinkage
SAE AMS3731/10B
Potting Compound, Epoxy, Bisphenol A-Type, Unfilled, Room Temperature Cure, Semiflexible
HG/T 3875-2006
Phenol aldehyde amine epoxy resin firming agent
SAE AMS3731/5A
Potting Compound, Epoxy, Bisphenol A-Type, Filled, Room Temperature Cure, Low Exotherm
SAE AMS3731/7A
Potting Compound, Epoxy, Bisphenol A-Type, Filled, Room Temperature Cure, Low Shrinkage