MIL MIL-I-24718/2
INSULATING RESINS, SOLVENTLESS, VACUUM-PRESSURE-IMPREGNATING REPLENISHMENT RESIN, EPOXY-LEWIS ACID, SLIGHTLY THIXOTROPIC
MIL MIL-I-24718/4
INSULATING RESINS, SOLVENTLESS, VACUUM-PRESSURE-IMPREGNATING REPLENISHMENT RESIN, POLYESTER DIALLY PHTHALATE, SLIGHTLY THIXOTROPIC
MIL MIL-I-24718/3
INSULATING RESINS, SOLVENTLESS, VACUUM-PRESSURE-IMPREGNATING POLYESTER DIALLYL PHTHALATE, SLIGHTLY THIXOTROPIC
MIL MIL-I-24718/1
INSULATING RESINS, SOLVENTLESS, VACUUM-PRESSURE-IMPREGNATING EPOXY-LEWIS ACID, SLIGHTLY THIXOTROPIC (NO S/S DOCUMENT)
MIL MIL-I-24092/6A
INSULATING RESIN, SOLVENTLESS, THIXOTROPIC, BAKING, FLEXIBLE, FOR DIP PROCESSING, GRADE SET, CLASS 130 TO 180 THERMAL CLASS (SUPERSEDING MIL-I-24092/6)
MIL MIL-I-24092/8A
INSULATING RESIN, SOLVENTLESS, THIXOTROPIC, BAKING, SEMI-RIGID, FOR DIP PROCESSING, GRADE SHT, CLASS 155 TO 200 THERMAL CLASS (SUPERSEDING MIL-I-24092/8)
MIL MIL-I-24092/6
INSULATING RESIN, SOLVENTLESS, THIXOTROPIC, BAKING, FLEXIBLE, FOR DIP PROCESSING (S/S BY MIL-I-24092/6A)
MIL MIL-I-24092/8
INSULATING RESIN, SOLVENTLESS, THIXOTROPIC, BAKING, SEMI-RIGID, FOR DIP PROCESSING (S/S BY MIL-I-24092/8A)
MIL MIL-R-47004
RESIN, EPOXY BASE, THIXOTROPIC (NO S/S DOCUMENT)