绝缘环氧树脂胶检测标准，绝缘环氧树脂胶检测标准标准内容,检测中心-北检（北京）检测技术研究院

GB/T 36797-2018

装修防开裂用环氧树脂接缝胶
Epoxy resin joint sealant for anti-cracking in refurbishment

【发布单位或类别】 CN-GB国家标准
【发布日期】2018-09-17
【CCS分类】G39胶粘剂
【ICS分类】83.180粘合剂和胶粘产品

GB/T 15022.3-2011

电气绝缘用树脂基活性复合物第3部分：无填料环氧树脂复合物
Resin based reactive compounds used for electrical insulation - Part 3: Unfilled epoxy resinous compounds

【发布单位或类别】 CN-GB国家标准
【发布日期】2011-12-30
【CCS分类】K15电工绝缘材料及其制品
【ICS分类】29.035.99其他绝缘材料

GB/T 15022.5-2011

电气绝缘用树脂基活性复合物第5部分：石英填料环氧树脂复合物
Resin based reactive compounds used for electrical insulation - Part 5：Quartz filled epoxy resinous compounds

【发布单位或类别】 CN-GB国家标准
【发布日期】2011-12-30
【CCS分类】K15电工绝缘材料及其制品
【ICS分类】29.035.99其他绝缘材料

MIL MIL-I-46865B

INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)
INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)

【发布单位或类别】 US-MIL美国军事规范和标准
【发布日期】1991-06-28
【CCS分类】电工绝缘材料及其制品
【ICS分类】其他绝缘材料

MIL MIL-I-46865B Notice 3-Cancellation

INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)
INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)

【发布单位或类别】 US-MIL美国军事规范和标准
【发布日期】1997-11-24
【CCS分类】电工绝缘材料及其制品
【ICS分类】其他绝缘材料

MIL MIL-I-46865B Notice 2-Reactivation

INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)
INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)

【发布单位或类别】 US-MIL美国军事规范和标准
【发布日期】1997-03-12
【CCS分类】电工绝缘材料及其制品
【ICS分类】其他绝缘材料

KS C IEC 60371-3-7-2014(2019)

마이카 절연 재료 — 제3부: 개별 재료의 시방서 — 제7절: 단선 도체 테이핑용 에폭시 수지 결합체가 함유된 폴리에스터 필름 집성 마이카
Insulating materials based on mica — Part 3: Specifications for individual materials — Sheet 7: Polyester film mica paper with an epoxy resin binder for single conductor taping

【发布单位或类别】 KR-KS韩国标准
【发布日期】2014-10-27
【CCS分类】电工绝缘材料及其制品
【ICS分类】云母基材料

GB/T 5019.8-2009

以云母为基的绝缘材料第8部分：玻璃布补强B阶环氧树脂粘合云母带
Specification for insulating materials based on mica - Part 8: Glass-backed mica paper with a B-stage epoxy resin binder

【发布单位或类别】 CN-GB国家标准
【发布日期】2009-06-10
【CCS分类】K15
【ICS分类】29.035.99其他绝缘材料

GB/T 5019.6-2007

以云母为基的绝缘材料第6部分: 聚酯薄膜补强B阶环氧树脂粘合云母带
Specification for insulating materials based on mica - Part 3: Specifications for individual materials - Sheet 4: Polyester film-backed mica paper with a B-stage epoxy resin binder

【发布单位或类别】 CN-GB国家标准
【发布日期】2007-12-03
【CCS分类】K15
【ICS分类】29.035.99云母基材料

GB/T 5019.9-2009

以云母为基的绝缘材料第9部分：单根导线包绕用环氧树脂粘合聚酯薄膜云母带
Insulating materials based on mica - Part 9: Polyester film mica paper with an epoxy resin binder for single conductor taping

【发布单位或类别】 CN-GB国家标准
【发布日期】2009-06-10
【CCS分类】K15
【ICS分类】29.035.99有关制药学的其他标准

SAE AMS3731/9C

Potting Compound, Epoxy Flexible, Thermal Shock Resistant, Heat Cure
Potting Compound, Epoxy Flexible, Thermal Shock Resistant, Heat Cure

【发布单位或类别】 US-SAE美国机动车工程师协会
【发布日期】2016-09-22
【CCS分类】
【ICS分类】

IEC 60371-3-7:1995/AMD1:2006

Amendment 1 - Insulating materials based on mica - Part 3: Specifications for individual materials - Sheet 7: Polyester film mica paper with an epoxy resin binder for single conductor taping
Amendment 1 - Insulating materials based on mica - Part 3: Specifications for individual materials - Sheet 7: Polyester film mica paper with an epoxy resin binder for single conductor taping

【发布单位或类别】 IX-IEC国际电工委员会
【发布日期】2006-09-27
【CCS分类】
【ICS分类】29.035.50

GB/T 5019.7-2009

以云母为基的绝缘材料第7部分：真空压力浸渍（VPI）用玻璃布及薄膜补强环氧树脂粘合云母带
Insulating materials based on mica - Part 7: Glass-backed and film-backed mica paper with an epoxy resin binder for vacuum pressure impregnation(VPI)

【发布单位或类别】 CN-GB国家标准
【发布日期】2009-06-10
【CCS分类】K15
【ICS分类】29.035.99

UNE-EN 60371-3-7:1996

SPECIFICATION FOR INSULATING MATERIALS BASED ON MICA. PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS. SHEET 7: POLYESTER FILM MICA PAPER WITH AN EPOXY RESIN BINDER FOR SINGLE CONDUCTOR TAPING.
SPECIFICATION FOR INSULATING MATERIALS BASED ON MICA. PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS. SHEET 7: POLYESTER FILM MICA PAPER WITH AN EPOXY RESIN BINDER FOR SINGLE CONDUCTOR TAPING.

【发布单位或类别】 ES-UNE西班牙标准
【发布日期】1996-11-12
【CCS分类】
【ICS分类】

IEC 60371-3-7:1995

Insulating materials based on mica - Part 3: Specifications for individual materials - Sheet 7: Polyester film mica paper with an epoxy resin binder for single conductor taping
Insulating materials based on mica - Part 3: Specifications for individual materials - Sheet 7: Polyester film mica paper with an epoxy resin binder for single conductor taping

【发布单位或类别】 IX-IEC国际电工委员会
【发布日期】1995-08-30
【CCS分类】
【ICS分类】29.035.50

SAE AMS3731/1C

Potting Compound, Epoxy Bisphenol A-Type Unfilled, Room Temperature Cure
Potting Compound, Epoxy Bisphenol A-Type Unfilled, Room Temperature Cure

【发布单位或类别】 US-SAE美国机动车工程师协会
【发布日期】2016-09-22
【CCS分类】
【ICS分类】

T/HZBX 063-2023

环氧树脂AB胶制作植物类中药饮片标本技术规程

【发布单位或类别】 CN-TUANTI团体标准
【发布日期】2023-06-30
【CCS分类】
【ICS分类】11.120.99

MIL MIL-I-24768/3 Notice 1-Validation 1

INSULATION, PLASTIC, LAMINATED, THERMOSETTING, GLASS-CLOTH, EPOXY-RESIN (GEB)
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, GLASS-CLOTH, EPOXY-RESIN (GEB)

【发布单位或类别】 US-MIL美国军事规范和标准
【发布日期】2020-03-10
【CCS分类】
【ICS分类】

MIL MIL-I-24768/26 Notice 1-Validation 1

INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, EPOXY-RESIN (PEE)
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, EPOXY-RESIN (PEE)

【发布单位或类别】 US-MIL美国军事规范和标准
【发布日期】2020-03-10
【CCS分类】
【ICS分类】

SAE AMS3731/7C

Potting Compound, Epoxy Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage
Potting Compound, Epoxy Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage

【发布单位或类别】 US-SAE美国机动车工程师协会
【发布日期】2016-09-22
【CCS分类】
【ICS分类】

绝缘环氧树脂胶检测标准

装修防开裂用环氧树脂接缝胶 Epoxy resin joint sealant for anti-cracking in refurbishment

电气绝缘用树脂基活性复合物 第3部分：无填料环氧树脂复合物 Resin based reactive compounds used for electrical insulation - Part 3: Unfilled epoxy resinous compounds

电气绝缘用树脂基活性复合物 第5部分：石英填料环氧树脂复合物 Resin based reactive compounds used for electrical insulation - Part 5：Quartz filled epoxy resinous compounds

INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A) INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)

INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A) INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)

INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A) INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)

以云母为基的绝缘材料 第8部分：玻璃布补强B阶环氧树脂粘合云母带 Specification for insulating materials based on mica - Part 8: Glass-backed mica paper with a B-stage epoxy resin binder

以云母为基的绝缘材料 第6部分: 聚酯薄膜补强B阶环氧树脂粘合云母带 Specification for insulating materials based on mica - Part 3: Specifications for individual materials - Sheet 4: Polyester film-backed mica paper with a B-stage epoxy resin binder

以云母为基的绝缘材料 第9部分：单根导线包绕用环氧树脂粘合聚酯薄膜云母带 Insulating materials based on mica - Part 9: Polyester film mica paper with an epoxy resin binder for single conductor taping

Potting Compound, Epoxy Flexible, Thermal Shock Resistant, Heat Cure Potting Compound, Epoxy Flexible, Thermal Shock Resistant, Heat Cure

以云母为基的绝缘材料 第7部分：真空压力浸渍（VPI）用玻璃布及薄膜补强环氧树脂粘合云母带 Insulating materials based on mica - Part 7: Glass-backed and film-backed mica paper with an epoxy resin binder for vacuum pressure impregnation(VPI)

Potting Compound, Epoxy Bisphenol A-Type Unfilled, Room Temperature Cure Potting Compound, Epoxy Bisphenol A-Type Unfilled, Room Temperature Cure

环氧树脂AB胶制作植物类中药饮片标本技术规程

INSULATION, PLASTIC, LAMINATED, THERMOSETTING, GLASS-CLOTH, EPOXY-RESIN (GEB) INSULATION, PLASTIC, LAMINATED, THERMOSETTING, GLASS-CLOTH, EPOXY-RESIN (GEB)

INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, EPOXY-RESIN (PEE) INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, EPOXY-RESIN (PEE)

Potting Compound, Epoxy Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage Potting Compound, Epoxy Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage

北检院部分仪器展示

装修防开裂用环氧树脂接缝胶
Epoxy resin joint sealant for anti-cracking in refurbishment

电气绝缘用树脂基活性复合物第3部分：无填料环氧树脂复合物
Resin based reactive compounds used for electrical insulation - Part 3: Unfilled epoxy resinous compounds

电气绝缘用树脂基活性复合物第5部分：石英填料环氧树脂复合物
Resin based reactive compounds used for electrical insulation - Part 5：Quartz filled epoxy resinous compounds

INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)
INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)

INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)
INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)

INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)
INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)

以云母为基的绝缘材料第8部分：玻璃布补强B阶环氧树脂粘合云母带
Specification for insulating materials based on mica - Part 8: Glass-backed mica paper with a B-stage epoxy resin binder

以云母为基的绝缘材料第6部分: 聚酯薄膜补强B阶环氧树脂粘合云母带
Specification for insulating materials based on mica - Part 3: Specifications for individual materials - Sheet 4: Polyester film-backed mica paper with a B-stage epoxy resin binder

以云母为基的绝缘材料第9部分：单根导线包绕用环氧树脂粘合聚酯薄膜云母带
Insulating materials based on mica - Part 9: Polyester film mica paper with an epoxy resin binder for single conductor taping

Potting Compound, Epoxy Flexible, Thermal Shock Resistant, Heat Cure
Potting Compound, Epoxy Flexible, Thermal Shock Resistant, Heat Cure

以云母为基的绝缘材料第7部分：真空压力浸渍（VPI）用玻璃布及薄膜补强环氧树脂粘合云母带
Insulating materials based on mica - Part 7: Glass-backed and film-backed mica paper with an epoxy resin binder for vacuum pressure impregnation(VPI)

Potting Compound, Epoxy Bisphenol A-Type Unfilled, Room Temperature Cure
Potting Compound, Epoxy Bisphenol A-Type Unfilled, Room Temperature Cure

INSULATION, PLASTIC, LAMINATED, THERMOSETTING, GLASS-CLOTH, EPOXY-RESIN (GEB)
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, GLASS-CLOTH, EPOXY-RESIN (GEB)

INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, EPOXY-RESIN (PEE)
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, EPOXY-RESIN (PEE)

Potting Compound, Epoxy Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage
Potting Compound, Epoxy Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage