MIL MIL-I-24718/2
INSULATING RESINS, SOLVENTLESS, VACUUM-PRESSURE-IMPREGNATING REPLENISHMENT RESIN, EPOXY-LEWIS ACID, SLIGHTLY THIXOTROPIC
MIL MIL-R-47004
RESIN, EPOXY BASE, THIXOTROPIC (NO S/S DOCUMENT)
MIL MIL-I-24718/1
INSULATING RESINS, SOLVENTLESS, VACUUM-PRESSURE-IMPREGNATING EPOXY-LEWIS ACID, SLIGHTLY THIXOTROPIC (NO S/S DOCUMENT)
MIL MIL-I-24718/4
INSULATING RESINS, SOLVENTLESS, VACUUM-PRESSURE-IMPREGNATING REPLENISHMENT RESIN, POLYESTER DIALLY PHTHALATE, SLIGHTLY THIXOTROPIC
GB/T 41928-2022
Plastics—Epoxy resins—Determination of degree of crosslinking of crosslinked epoxy resins by differential scanning calorimetry (DSC)
GB/T 1630.2-2023
Plastics—Epoxy resins—Part 2: Preparation of test specimens and determination of properties of crosslinked epoxy resins
GB/T 41929-2022
Plastics—Epoxy resins—Test methods
GB/T 13657-2011
Bisphenol-A epoxy resin
MIL MIL-I-24718/3
INSULATING RESINS, SOLVENTLESS, VACUUM-PRESSURE-IMPREGNATING POLYESTER DIALLYL PHTHALATE, SLIGHTLY THIXOTROPIC
GB/T 22314-2008
Plastics - Epoxide resins - Determination of viscosity
HG/T 4566-2013
Epoxy resin primer
JC/T 2630-2021
MIL MIL-I-24092/6A
INSULATING RESIN, SOLVENTLESS, THIXOTROPIC, BAKING, FLEXIBLE, FOR DIP PROCESSING, GRADE SET, CLASS 130 TO 180 THERMAL CLASS (SUPERSEDING MIL-I-24092/6)
JG/T 502-2016
HG/T 4765-2014
MIL MIL-I-24092/8A
INSULATING RESIN, SOLVENTLESS, THIXOTROPIC, BAKING, SEMI-RIGID, FOR DIP PROCESSING, GRADE SHT, CLASS 155 TO 200 THERMAL CLASS (SUPERSEDING MIL-I-24092/8)
HG/T 6276-2024
JC/T 2217-2014
Epoxy resin waterproof coating
HG/T 4759-2014
JC/T 1015-2006
Epoxy resin flooring coating