SAE AMS3731C
Potting Compound, Epoxy Bisphenol A-Type
SAE AMS3731/4C
Potting Compound, Epoxy Bisphenol A-Type Impregnating Resin, Heat Cure, Single Component
SAE AMS3731/6C
Potting Compound, Epoxy Bisphenol A-Type Syntactic Foam, Heat Cure
KS M 5708-2006
Silicone alkyd copolymer enamels
SAE AMS3731/5C
Potting Compound, Epoxy Bisphenol A-Type Filled, Room Temperature Cure, Low Exotherm
SAE AMS3731/8C
Potting Compound, Epoxy Bisphenol A-Type Filled, Heat Cure, High HDT
SAE AMS3731/10C
Potting Compound, Epoxy, Bisphenol A-Type, Unfilled, Room Temperature Cure, Semiflexible
SAE AMS3731/2D
Potting Compound, Epoxy Bisphenol A-Type Filled, Heat Cure, Low CTE Thermal Shock Resistant
MIL MIL-C-47153 Notice 1-Cancellation
COMPOUND, INSULATING, POTTING AND ENCAPSULATING, EPOSY RESIN (NO S/S DOCUMENT)
ASTM D7750-23
Standard Test Method for Cure Behavior of Thermosetting Resins by Dynamic Mechanical Procedures using an Encapsulated Specimen Rheometer
BS 5689-3.2:1995
Varnished fabrics for electrical purposes. Specifications for individual materials-Glass fabric based varnished fabrics with epoxy, polyurethane, silicone, polyester, bituminous or oleoresinous varnish
MIL MIL-I-24092/9A
INSULATING RESIN, SOLVENTLESS, SILICONE, BAKING, FOR DIP PROCESSING, GRADE SS, CLASS 180 TO 220 THERMAL CLASS (SUPERSEDING MIL-I-24092/9)
SAE AMS3731B
Potting Compound, Epoxy, Bisphenol A-Type
SAE AMS3731A
Potting Compound, Epoxy, Bisphenol A-Type
SAE AMS3731/4B
Potting Compound, Epoxy, Bisphenol A-Type, Impregnating Resin, Heat Cure, Single Component
SAE AMS3731/4A
Potting Compound, Epoxy, Bisphenol A-Type, Impregnating Resin, Heat Cure, Single Component
SAE AMS3731/6B
Potting Compound, Epoxy, Bisphenol A-Type, Syntactic Foam, Heat Cure
SAE AMS3731/6A
Potting Compound, Epoxy, Bisphenol A-Type, Syntactic Foam, Heat Cure
SAE AMS3731
Potting Compound, Epoxy, Bisphenol A-Type
MIL MIL-I-46865B
INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)