SAE AMS3750A
Potting Compound, Epoxy, Flexible Durometer 75-85
HG/T 5876-2021
Epoxy vinyl ester resin
SAE AMS3750
Potting Compound, Epoxy, Flexible Durometer 75-85
SJ/T 11125-1997
Encapsulation materials of epoxy series for use in electronic components
JB/T 13575-2018
Resin based reactive compounds used for electrical insulation- Epoxy continuous dip-impregnating resins
JB/T 13574-2018
Resin based reactive compounds used for electrical insulation Epoxy-drop-impregnating resins
GB/T 15022.7-2017
Resin based reactive compounds used for electrical insulation—Part 7: Epoxy-anhydride vacuum pressure impregnation(VPI) resin
HG/T 2625-1994
GB/T 15022.8-2017
Resin based reactive compounds used for electrical insulation— Part 8:Epoxy modified unsaturated polyester vacuum pressure impregnation (VPI) resin
SN/T 4182-2015
Determination of propylene oxide and epichlorohydrin monomers in imported epoxy coating - Headspace-gas chromatography
GB/T 15022.6-2014
Resin based reactive compounds used for electrical insulation―Part 6:Epoxy casting resinous compounds use for class 1E distribution transformer in nuclear power generating stations
QJ 3184-2003
Specification for T300 carbon fiber/AG-80 epoxy prepreg
GB 9686-2012
SJ 20451-1994
Electrical insulating epoxy compound colloidal silica filled for potting and encapsulation
CID A-A-59785
EPOXY COATING KIT (EPOXY RESIN SYSTEM)
JB/T 10322.3-2002
ASTM D1652-11(2019)
Standard Test Method for Epoxy Content of Epoxy Resins
SAE AMS3731/9C
Potting Compound, Epoxy Flexible, Thermal Shock Resistant, Heat Cure
SAE AMS3732B
Potting Compound, Epoxy One Part, Filled, Heat Cure, Low CTE
SAE AMS3731/1C
Potting Compound, Epoxy Bisphenol A-Type Unfilled, Room Temperature Cure