GB/T 36797-2018
Epoxy resin joint sealant for anti-cracking in refurbishment
T/CEEIA 669-2023
SAE AMS3731/9C
Potting Compound, Epoxy Flexible, Thermal Shock Resistant, Heat Cure
SAE AMS3731/1C
Potting Compound, Epoxy Bisphenol A-Type Unfilled, Room Temperature Cure
SAE AMS3733C
Potting Compound, Epoxy, Two Part, Highly Filled, Heat Cure, High Compressive Strength
T/HZBX 063-2023
SAE AMS3731/7C
Potting Compound, Epoxy Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage
GB/T 5019.13-2023
Insulating materials based on mica—Part 13:High thermal conductivity glass-backed mica tape with less resin
SAE AMS3740B
Potting Compound, Epoxy, Filled 15 - 20 Cte, 225 Hdt Free Machining
MIL MIL-PRF-22750G Notice 1-Administrative
Coating, Epoxy, High-Solids
MIL MIL-PRF-22750G Amendment 1(amendment incorporated)
Coating, Epoxy, High-Solids
MIL MIL-PRF-23377K Notice 1-Validation 1
Primer Coatings: Epoxy, High-Solids
SAE AMS3731/9B
Potting Compound, Epoxy, Flexible, Thermal Shock Resistant, Heat Cure
MIL MIL-PRF-22750G
Coating, Epoxy, High-Solids
MIL MIL-PRF-23377K
Primer Coatings: Epoxy, High-Solids
T/DLSHXH 006-2017
SAE AMS3733B
Potting Compound, Epoxy, Two Part, Highly Filled, Heat Cure, High Compressive Strength
SAE AMS3731/9A
Potting Compound, Epoxy, Flexible, Thermal Shock Resistant, Heat Cure
SAE AMS3731/1B
Potting Compound, Epoxy, Bisphenol A-Type, Unfilled, Room Temperature Cure
SAE AMS3733A
Potting Compound, Epoxy, Two Part, Highly Filled, Heat Cure, High Compressive Strength