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双马来酰亚胺树脂检测标准

发布时间：2025-02-09 21:26:57 点击数：
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GB/T 1303.10-2009

电气用热固性树脂工业硬质层压板 第10部分：双马来酰亚胺树脂硬质层压板

Industrial rigid laminated sheets based on thermosetting resins for electrical purposes - Part 10: Requirements for rigid laminated sheets based on bis-maleimide resins

  • 【发布单位或类别】 CN-GB国家标准
  • 【发布日期】2009-06-10
  • 【CCS分类】K15电工绝缘材料及其制品
  • 【ICS分类】29.035.01绝缘材料综合

DIN 65453

Aerospace; preimpregnated unidirectional sheet of carbon fibres and bismaleinimide- or polyimide resin; technical specification

Aerospace; preimpregnated unidirectional sheet of carbon fibres and bismaleinimide- or polyimide resin; technical specification

  • 【发布单位或类别】 DE-DIN德国标准化学会
  • 【发布日期】1993-02-01
  • 【CCS分类】电工绝缘材料及其制品
  • 【ICS分类】电子技术专用材料

JIS C 6524:1995

Prepreg for multilayer printed wiring boards -- Bismaleimide/Triazine/Epoxide resin-Impregnated glass Cloth

Prepreg for multilayer printed wiring boards -- Bismaleimide/Triazine/Epoxide resin-Impregnated glass Cloth

  • 【发布单位或类别】 JP-JSA日本工业标准调查会
  • 【发布日期】1995-01-01
  • 【CCS分类】
  • 【ICS分类】印制电路和印制电路板

20232460-T-469

集成电路用双马来酰亚胺/三嗪（BT）封装基材

Bismaleimide/ triazine (BT) base material for Integrated circuit (IC) package

  • 【发布单位或类别】 CN-PLAN国家标准计划
  • 【发布日期】2023-12-28
  • 【CCS分类】
  • 【ICS分类】31.030印制电路和印制电路板

KS C 6456-1995(2000)

프린트 배선판용 동입힘 적층판 - 유리천 바탕 비스마레이미드/트리아진/에폭시 수지

COPPER-CLAD LAMINATES FOR PRINTED WIRING BOARDS-GLASS FABRIC BASE, BISMALEIMIDE/TRIAZINE/EPOXIDE

  • 【发布单位或类别】 KR-KS韩国标准
  • 【发布日期】1995-01-05
  • 【CCS分类】
  • 【ICS分类】31.180印制电路和印制电路板

KS C 6514-1997

다층 프린트 배선판용 프르프레그 - 유리천 바탕재 비스마레이미드/트리아진/에폭시 수지

PREPREG FOR MULTILAYER PRINTED WIRING BOARDS - BISMALEIMIDE/TRIAZINE/EPOXIDE RESIN - IMPREGNATED GLASS CLOTH

  • 【发布单位或类别】 KR-KS韩国标准
  • 【发布日期】1997-10-20
  • 【CCS分类】
  • 【ICS分类】31.180绝缘材料综合

MIL MIL-S-13949/26A Notice 1-Inactivation

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEIMIDE MODIFIED EPOXY RESIN) (SUPERSEDING MIL-S-13949/26) (NO S/S DOCUMENT)

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEIMIDE MODIFIED EPOXY RESIN) (SUPERSEDING MIL-S-13949/26) (NO S/S DOCUMENT)

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】1997-08-01
  • 【CCS分类】
  • 【ICS分类】印制电路和印制电路板

MIL MIL-S-13949/26A

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEIMIDE MODIFIED EPOXY RESIN) (SUPERSEDING MIL-S-13949/26) (NO S/S DOCUMENT)

SHEET, PRINTED WIRING BOARD, PREPREG, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEIMIDE MODIFIED EPOXY RESIN) (SUPERSEDING MIL-S-13949/26) (NO S/S DOCUMENT)

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】1993-04-11
  • 【CCS分类】
  • 【ICS分类】

IEC 61249-2-27:2012

Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad

Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad

  • 【发布单位或类别】 IX-IEC国际电工委员会
  • 【发布日期】2012-11-29
  • 【CCS分类】
  • 【ICS分类】31.180

MIL MIL-S-13949/24A

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEMIDE MODIFIED EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/24) (NO S/S DOCUMENT)

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEMIDE MODIFIED EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/24) (NO S/S DOCUMENT)

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】1993-04-11
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-S-13949/24A Notice 2-Cancellation

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEMIDE MODIFIED EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/24) (NO S/S DOCUMENT)

SHEET, PRINTED WIRING BOARD, LAMINATED, BASE MATERIAL GM (WOVEN E-GLASS REINFORCEMENT, TRIAZINE AND OR BISMALEMIDE MODIFIED EPOXY RESIN, FLAME RESISTANT, METAL CLAD OR UNCLAD) (SUPERSEDING MIL-S-13949/24) (NO S/S DOCUMENT)

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】1998-11-30
  • 【CCS分类】
  • 【ICS分类】

GB/T 1303.11-2009

电气用热固性树脂工业硬质层压板 第11部分：聚酰胺酰亚胺树脂硬质层压板

Industrial rigid laminated sheets based on thermosetting resins for electrical purposes - Part 11: Requirements for rigid laminated sheets based on polyamide-imide resins

  • 【发布单位或类别】 CN-GB国家标准
  • 【发布日期】2009-06-10
  • 【CCS分类】K15
  • 【ICS分类】29.035.01

SME EM910232

Bismaleimide Tooling For 350f Application

Bismaleimide Tooling For 350f Application

  • 【发布单位或类别】 JP-SM日本船用装置工业会
  • 【发布日期】1991-06-01
  • 【CCS分类】
  • 【ICS分类】

JIS C 6492:1998

Base materials for printed circuits -- Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

Base materials for printed circuits -- Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

  • 【发布单位或类别】 JP-JSA日本工业标准调查会
  • 【发布日期】1998-01-01
  • 【CCS分类】
  • 【ICS分类】

ASM P-27

ULTEM 6000 - Polyetherimide (PEI) Copolymer Resin

ULTEM 6000 - Polyetherimide (PEI) Copolymer Resin

  • 【发布单位或类别】 AU-SA澳大利亚标准协会
  • 【发布日期】1991-06-01
  • 【CCS分类】
  • 【ICS分类】

JIS C 6494:1999

Base materials for printed circuits -- Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

Base materials for printed circuits -- Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

  • 【发布单位或类别】 JP-JSA日本工业标准调查会
  • 【发布日期】1999-01-01
  • 【CCS分类】
  • 【ICS分类】

KS C IEC 61249-2-9-2011(2016)

인쇄회로기판 및 기타 전자배선용 재료－제2-9부：동박적층 난연등급(수직연소 시험)의 유리섬유 직조 비스말레이미드/트리아진 변형 또는 무변형 에폭시 동박적층판 및 무동박적층판

Materials for printed boards and other interconnecting structures－Part 2-9：Reinforced base materials clad and unclad－Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

  • 【发布单位或类别】 KR-KS韩国标准
  • 【发布日期】2011-07-28
  • 【CCS分类】
  • 【ICS分类】31.180

BS EN 60249-2-19:1993

Specifications-Specification No. 19. Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

Specifications-Specification No. 19. Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

  • 【发布单位或类别】 GB-BSI英国标准学会
  • 【发布日期】1992-09-15
  • 【CCS分类】
  • 【ICS分类】

UNE-EN 60249-2-18:1997

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICTION Nº 18: BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICTION Nº 18: BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).

  • 【发布单位或类别】 ES-UNE西班牙标准
  • 【发布日期】1997-10-17
  • 【CCS分类】
  • 【ICS分类】

SAE AMS3701C

Epoxy Resin, Tetraglycidyl Methylenedianiline (TGMDA), 10,000 to 14,000 Centipoise Viscosity

Epoxy Resin, Tetraglycidyl Methylenedianiline (TGMDA), 10,000 to 14,000 Centipoise Viscosity

  • 【发布单位或类别】 US-SAE美国机动车工程师协会
  • 【发布日期】1995-04-01
  • 【CCS分类】
  • 【ICS分类】

北检院部分仪器展示

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