机构简介
北检(北京)检测技术研究院(简称：北检院)，依托科研测试与材料检测重点领域，结合“211工程”和“985工程”建设，面向学校和社会企业开放的仪器共享机构和跨学科检测交叉融合平台。面向企业及科研单位跨学科研究、面向社会公共服务，构建具有装备优势、人才优势和服务优势的综合科研检测服务平台。 了解更多 +
仪器展示
塑料检测
橡胶检测
高分子材料检测
纺织品检测
建筑材料检测
金属材料检测
生物领域检测
动物领域检测
非标试验
植物领域检测
矿石检测
油品检测
热门检测
最新检测
最新检测
热门检测
检测标准

tpu电镀树脂检测标准

发布时间：2025-02-10 05:30:03 点击数：
在线咨询

HG/T 5877\uff5e5879-2021

防水透湿薄膜用热塑性聚氨酯（TPU）颗粒料、避孕套用水性聚氨酯树脂和织物涂层用水性聚氨酯树脂（2021）

  • 【发布单位或类别】 CN-HG行业标准-化工
  • 【发布日期】
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/2D

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2020-03-02
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/6C

Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications

Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2020-05-06
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/5C

Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications

Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2020-05-05
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/2A Amendment 4(all prev amd incorp.)

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2009-07-04
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/1D

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2017-06-01
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/2C Amendment 1

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2018-06-12
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/1C Amendment 1(amendment incorporated)

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2012-11-01
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/2B Amendment 1(amendment incorporated)

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2012-11-02
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/2A Amendment 3

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-Through Holes, for Soldered Part Mounting

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-Through Holes, for Soldered Part Mounting

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2008-04-23
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/2A Amendment 2

PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/2)

PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/2)

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2006-10-31
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/6B

Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications

Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2017-10-06
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/2C

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2017-06-02
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/5B

Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications

Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2017-10-05
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/6A

Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications

Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2012-12-11
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/2B

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2010-06-14
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/6

Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications

Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2008-03-11
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/5A

Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications

Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2012-12-09
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/5

Printed Wiring Board, Rigid, Multilayered, Thermoplastic or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications

Printed Wiring Board, Rigid, Multilayered, Thermoplastic or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2007-08-20
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/1C(all prev amd incorp.)

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2010-05-23
  • 【CCS分类】
  • 【ICS分类】

北检院部分仪器展示

北检仪器展示 北检仪器展示 北检仪器展示 北检仪器展示