tpu电镀树脂检测标准
CNAS认证
CMA认证
HG/T 5877\uff5e5879-2021
防水透湿薄膜用热塑性聚氨酯（TPU）颗粒料、避孕套用水性聚氨酯树脂和织物涂层用水性聚氨酯树脂（2021）
- 【发布单位或类别】 CN-HG行业标准-化工
- 【发布日期】
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/2D
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2020-03-02
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/6C
Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2020-05-06
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/5C
Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications
Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2020-05-05
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/2A Amendment 4(all prev amd incorp.)
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2009-07-04
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/1D
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2017-06-01
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/2C Amendment 1
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2018-06-12
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/1C Amendment 1(amendment incorporated)
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2012-11-01
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/2B Amendment 1(amendment incorporated)
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2012-11-02
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/2A Amendment 3
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-Through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-Through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2008-04-23
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/2A Amendment 2
PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/2)
PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/2)
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2006-10-31
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/6B
Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2017-10-06
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/2C
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2017-06-02
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/5B
Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications
Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2017-10-05
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/6A
Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2012-12-11
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/2B
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2010-06-14
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/6
Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2008-03-11
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/5A
Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications
Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2012-12-09
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/5
Printed Wiring Board, Rigid, Multilayered, Thermoplastic or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications
Printed Wiring Board, Rigid, Multilayered, Thermoplastic or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2007-08-20
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/1C(all prev amd incorp.)
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2010-05-23
- 【CCS分类】
- 【ICS分类】
