MIL MIL-PRF-907E Amendment 2
ANTISEIZE THREAD COMPOUND, HIGH TEMPERATURE (ADMINISTRATIVELY CHANGED FROM MIL-A TO MIL-PRF) (SUPERSEDING MIL-A-907D) (S/S BY MIL-PRF-907F)
MIL MIL-PRF-907E Amendment 1
ANTISEIZE THREAD COMPOUND, HIGH TEMPERATURE (ADMINISTRATIVELY CHANGED FROM MIL-A TO MIL-PRF) (SUPERSEDING MIL-A-907D) (S/S BY MIL-PRF-907F)
MIL MIL-M-46862B
MOLDING MATERIAL, GLASS, EPOXY IMPREGNATED (SUPERSEDING MIL-M-46862A)
QPL QPL-24092-39
INSULATING VARNISHES AND SOLVENTLESS RESINS FOR APPLICATION BY THE DIP PROCESS (SUPERSEDING QPL-24092-38)
MIL MIL-P-25515C Notice 2-Inactivation
PLASTIC MATERIALS, PHENOLIC RESIN, GLASS-FIBER BASE, LAMINATED (SUPERSEDING MIL-P-25515B)
MIL MIL-C-3154A Notice 1-Cancellation
CLOTH, COATED, COTTON (CREPED, PHENOLIC RESIN TREATED) (NO S/S DOCUMENT) (SUPERSEDING MIL-C-3154)
MIL MIL-R-15189B
RESIN, ALKYD PHENOLIC (NO S/S DOCUMENT) (SUPERSEDING MIL-R-15189A)
MIL MIL-P-25515C Notice 1-Validation
PLASTIC MATERIALS, PHENOLIC RESIN, GLASS-FIBER BASE, LAMINATED (SUPERSEDING MIL-P-25515B)
MIL MIL-R-23461A
RESIN COMPOUND, THERMOSETTING, ROOM TEMPERATURE CURING, FOR METAL COATING (SUPERSEDING MIL-R-23461)
QPL QPL-22397-23
ADHESIVE, PHENOL AND RESORCINOL RESIN BASE (FOR MARINE SERVICE USE) (SUPERSEDING QPL-22397-22)
MIL MIL-P-22296B Notice 2-Cancellation
PLASTIC TUBES AND TUBING, POLYTETRAFLUOROETHYLENE, (TFEFLUOROCARBON RESIN), HEAVY WALLED (SUPERSEDING MIL-P-22296A)(S/S BY ASTM-D1710-2002)
CB 20160-2016
Technical requirements of welding for L907A steel
QPL QPL-85334-4
SEALING COMPOUND, NON-CURING, LOW CONSISTENCY, SILICONE, GROOVE INJECTION, FOR INTERGRAL FUEL TANKS (SUPERSEDING QPL-85334-3)
QPL QPL-18177-105 Notice 1-Cancellation
PLASTIC SHEET, LAMINATED, THERMOSETTING, GLASS FIBER BASE, EPOXY-RESIN (NO S/S DOCUMENT) (SUPERSEDING QPL-18177-104)
MIL MIL-PRF-31032/2A Amendment 2
PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING (SUPERSEDING MIL-PRF-31032/2)
MIL MIL-I-24092/7A
INSULATING RESIN, SOLVENTLESS, BAKING, SEMI-RIGID, FOR DIP PROCESSING, GRADE SH, CLASS 155 TO 200 THERMAL CLASS (SUPERSEDING MIL-I-24092/7)
QPL QPL-19161-23 Notice 1-Cancellation
PLASTIC SHEET, LAMINATED, GLASS CLOTH POLYTETRAFLUOROETHYLENE RESIN (NO S/S DOCUMENT) (SUPERSEDING QPL-19161-22)
MIL MIL-I-46865B
INSULATING COMPOUND, ELECTRICAL, EPOXY, COLLOIDAL SILICA FILLED FOR POTTING AND ENCAPSULATION (NO S/S DOCUMENT) (SUPERSEDING MIL-I-46865A)
MIL MIL-I-24092/8A
INSULATING RESIN, SOLVENTLESS, THIXOTROPIC, BAKING, SEMI-RIGID, FOR DIP PROCESSING, GRADE SHT, CLASS 155 TO 200 THERMAL CLASS (SUPERSEDING MIL-I-24092/8)
MIL MIL-A-46146B Amendment 2
ADHESIVES-SEALANTS, SILICONE, RTV, NONCORROSIVE (FOR USE WITH SENSITIVE METALS AND EQUIPMENT)(SUPERSEDING MIL-A-46146A)