T/SHDSGY 024-2023
SAE AMS3681F
Adhesive, Electrically Conductive Silver-Filled Epoxy Resin
SAE AMS3727B
Resin, Epoxy, Matrix, Thermosetting, Moderate Temperature Resistant, Unfilled
SAE AMS3731/1C
Potting Compound, Epoxy Bisphenol A-Type Unfilled, Room Temperature Cure
SAE AMS3729A
Epoxy Resin Matrix, Thermosetting, Moderate Temperature Resistant, Unfilled
SAE AMS3731/3C
Potting Compound, Epoxy Bisphenol A-Type Filled, Heat Cure, Machinable
SAE AMS3731/5C
Potting Compound, Epoxy Bisphenol A-Type Filled, Room Temperature Cure, Low Exotherm
SAE AMS3731/7C
Potting Compound, Epoxy Bisphenol A-Type Filled, Room Temperature Cure, Low Shrinkage
SAE AMS3731/8C
Potting Compound, Epoxy Bisphenol A-Type Filled, Heat Cure, High HDT
SAE AMS3699A
Resin System, Epoxy, Carbon Microballoon Filled, 135 °C (275 °F) Cure
SAE AMS3731/10C
Potting Compound, Epoxy, Bisphenol A-Type, Unfilled, Room Temperature Cure, Semiflexible
SAE AMS3731/2D
Potting Compound, Epoxy Bisphenol A-Type Filled, Heat Cure, Low CTE Thermal Shock Resistant
SAE AMS3734B
Potting Compound, Epoxy, Unfilled General Purpose Room Temperature Cure
SAE AMS3681E
Adhesive, Electrically Conductive Silver-Filled Epoxy Resin
SAE AMS3681D
Adhesive, Electrically Conductive Silver-Filled Epoxy Resin
SAE AMS3740B
Potting Compound, Epoxy, Filled 15 - 20 Cte, 225 Hdt Free Machining
SAE AMS3733C
Potting Compound, Epoxy, Two Part, Highly Filled, Heat Cure, High Compressive Strength
SAE AMS3735C
Potting Compound, Epoxy, Filled 10 - 15 Cte, 225 Hdt
SAE AMS3738B
Potting Compound, Epoxy, Filled 15 - 20 Cte, 180 Hdt
KS C IEC 60455-3-2-2015(2020)
Resin based reactive compounds used for electrical insulation-Part 3:Specifications for individual materials-Sheet 2:Quartz filled epoxy resinous compounds