电镀银树脂检测标准
CNAS认证
CMA认证
HB/Z 5074-1993
电镀银工艺
- 【发布单位或类别】 CN-HB行业标准-航空
- 【发布日期】1993-11-05
- 【CCS分类】电子技术专用材料
- 【ICS分类】涂料和清漆
SJ/T 11774-2021
集成电路引线框架电镀银层技术规范
- 【发布单位或类别】 CN-SJ行业标准-电子
- 【发布日期】2021-03-05
- 【CCS分类】L90化工
- 【ICS分类】摩托车和机动自行车
T/CSTM 00637-2022
电镀银效果涂料
- 【发布单位或类别】 CN-TUANTI团体标准
- 【发布日期】2022-08-29
- 【CCS分类】G摩托车综合
- 【ICS分类】87.040
HB/Z 5109.15-2001
钝化溶液分析方法 电位滴定法测定电镀银钝化 溶液中重铬酸钾的含量
- 【发布单位或类别】 CN-HB行业标准-航空
- 【发布日期】2001-11-15
- 【CCS分类】
- 【ICS分类】
HB/Z 5109.16-2001
钝化溶液分析方法 电位滴定法测定电镀银钝化 溶液中硝酸钾的含量
- 【发布单位或类别】 CN-HB行业标准-航空
- 【发布日期】2001-11-15
- 【CCS分类】
- 【ICS分类】
HB/Z 5074-1978
电镀银工艺
- 【发布单位或类别】 CN-HB行业标准-航空
- 【发布日期】1979-06-25
- 【CCS分类】
- 【ICS分类】
DB44/T 1659-2015
摩托车和轻便摩托车用仿电镀银涂料
- 【发布单位或类别】 CN-DB44广东省地方标准
- 【发布日期】2015-09-07
- 【CCS分类】T80
- 【ICS分类】43.140
HB/Z 5099-1978
氰化电镀银溶液分析方法
- 【发布单位或类别】 CN-HB行业标准-航空
- 【发布日期】1979-09-19
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/2D
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2020-03-02
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/6C
Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2020-05-06
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/5C
Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications
Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2020-05-05
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/2A Amendment 4(all prev amd incorp.)
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2009-07-04
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/1D
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2017-06-01
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/2C Amendment 1
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2018-06-12
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/1C Amendment 1(amendment incorporated)
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2012-11-01
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/2B Amendment 1(amendment incorporated)
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2012-11-02
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/2A Amendment 3
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-Through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-Through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2008-04-23
- 【CCS分类】
- 【ICS分类】
BS 6669-3:1989
Methods of test for electroplated silver and silver alloy coatings-Detection of residual salts
Methods of test for electroplated silver and silver alloy coatings-Detection of residual salts
- 【发布单位或类别】 GB-BSI英国标准学会
- 【发布日期】1989-08-31
- 【CCS分类】
- 【ICS分类】
FED QQ-S-365D
SILVER PLATING, ELECTRODEPOSITED, GENERAL REQUIREMENTS FOR (SUPERSEDING QQ-S-365C) (S/S BY ASTM-B700-1997(R02))
SILVER PLATING, ELECTRODEPOSITED, GENERAL REQUIREMENTS FOR (SUPERSEDING QQ-S-365C) (S/S BY ASTM-B700-1997(R02))
- 【发布单位或类别】 UNKNOWN其他未分类
- 【发布日期】1985-06-03
- 【CCS分类】
- 【ICS分类】
BS 6669-1:1986
Methods of test for electroplated silver and silver alloy coatings-Determination of coating thickness
Methods of test for electroplated silver and silver alloy coatings-Determination of coating thickness
- 【发布单位或类别】 GB-BSI英国标准学会
- 【发布日期】1986-05-30
- 【CCS分类】
- 【ICS分类】
