MIL MIL-PRF-47257F
Compound, Epoxy, Filament Winding
SAE AMS3731C
Potting Compound, Epoxy Bisphenol A-Type
SAE AMS3731/4C
Potting Compound, Epoxy Bisphenol A-Type Impregnating Resin, Heat Cure, Single Component
SAE AMS3731/6C
Potting Compound, Epoxy Bisphenol A-Type Syntactic Foam, Heat Cure
MIL MIL-R-81294D Notice 2-Validation 1
REMOVER, PAINT, EPOXY, POLYSULFIDE, AND POLYURETHANE SYSTEMS
SAE AMS3731/8C
Potting Compound, Epoxy Bisphenol A-Type Filled, Heat Cure, High HDT
SAE AMS3731/5C
Potting Compound, Epoxy Bisphenol A-Type Filled, Room Temperature Cure, Low Exotherm
ASTM D1726-11(2019)
Standard Test Methods for Hydrolyzable Chloride Content of Liquid Epoxy Resins
SAE AMS3731/10C
Potting Compound, Epoxy, Bisphenol A-Type, Unfilled, Room Temperature Cure, Semiflexible
ASTM D4301-05(2019)
Standard Test Method for Total Chlorine in Epoxy Resins and Compounds
KS D 2055-2016
Method for determination of lead and cadmium in epoxy molding compound
SAE AMS3730
Potting Compound, Foamed Epoxy Type, Amine Hardened
SAE AMS3731/2D
Potting Compound, Epoxy Bisphenol A-Type Filled, Heat Cure, Low CTE Thermal Shock Resistant
KS C IEC 60455-3-2-2015(2020)
Resin based reactive compounds used for electrical insulation-Part 3:Specifications for individual materials-Sheet 2:Quartz filled epoxy resinous compounds
SAE AMS3734B
Potting Compound, Epoxy, Unfilled General Purpose Room Temperature Cure
SAE AMS3735C
Potting Compound, Epoxy, Filled 10 - 15 Cte, 225 Hdt
MIL MIL-P-46067B Notice 2-Reactivation
PLASTIC EMBEDDING COMPOUND, EPOXY RESIN SYSTEM (SUPERSEDING MIL-P-46067A)
MIL MIL-P-46067B Notice 3-Inactivation
PLASTIC EMBEDDING COMPOUND, EPOXY RESIN SYSTEM (SUPERSEDING MIL-P-46067A)
SAE AMS3738B
Potting Compound, Epoxy, Filled 15 - 20 Cte, 180 Hdt
KS C IEC 60455-3-1-2020
Resin based reactive compounds used for electrical insulation —Part 3: Specifications for individual materials —Sheet 1: Unfilled epoxy resinous compounds