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检测标准

uv树脂重复多层检测标准

发布时间：2025-02-11 04:44:08 点击数：
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GB/T 24147-2009

水性紫外光（UV）固化树脂 水溶性不饱和聚酯丙烯酸酯树脂

Waterborne ultraviolet curable resin - Water soluble unsaturated polyester acrylate resin

  • 【发布单位或类别】 CN-GB国家标准
  • 【发布日期】2009-06-15
  • 【CCS分类】G51涂料
  • 【ICS分类】87.040涂料和清漆

JIS K 6941:2019

UV curable resin and thermosetting resin -- Continuous measurement method of shrinkage rate

UV curable resin and thermosetting resin -- Continuous measurement method of shrinkage rate

  • 【发布单位或类别】 JP-JSA日本工业标准调查会
  • 【发布日期】2019-01-01
  • 【CCS分类】
  • 【ICS分类】印制电路和印制电路板

BS ISO 4216:2021

Thermosetting resin and UV curable resin. Determination of shrinkage by continuous measurement method

Thermosetting resin and UV curable resin. Determination of shrinkage by continuous measurement method

  • 【发布单位或类别】 GB-BSI英国标准学会
  • 【发布日期】2021-05-10
  • 【CCS分类】
  • 【ICS分类】印制电路和印制电路板

SME EM97-131

Low Cost Manufacturing Processes Using Uv Cure Resins

Low Cost Manufacturing Processes Using Uv Cure Resins

  • 【发布单位或类别】 JP-SM日本船用装置工业会
  • 【发布日期】1997-06-01
  • 【CCS分类】
  • 【ICS分类】

SAE AMS3895C

Broadgoods and Tape, Carbon Fiber-Epoxy Resin Impregnated Multi-Ply, Uniform Fiber

Broadgoods and Tape, Carbon Fiber-Epoxy Resin Impregnated Multi-Ply, Uniform Fiber

  • 【发布单位或类别】 US-SAE美国机动车工程师协会
  • 【发布日期】2016-12-15
  • 【CCS分类】
  • 【ICS分类】

KS C 6458-1997(2017)

다층 프린트 배선판용 프리프레그 (유리천 바탕재 에폭시 수지)

Prepreg for multilayer printed wiring boards (Epoxy resin-Impregnated glass cloth)

  • 【发布单位或类别】 KR-KS韩国标准
  • 【发布日期】1997-08-19
  • 【CCS分类】
  • 【ICS分类】31.180

KS C 6458-1997(2022)

다층 프린트 배선판용 프리프레그 (유리천 바탕재 에폭시 수지)

Prepreg for multilayer printed wiring boards (Epoxy resin-Impregnated glass cloth)

  • 【发布单位或类别】 KR-KS韩国标准
  • 【发布日期】1997-08-19
  • 【CCS分类】
  • 【ICS分类】31.180

JIS C 6522:1996

Prepreg for multilayer printed wiring boards -- Epoxy resin-impregnated glass cloth

Prepreg for multilayer printed wiring boards -- Epoxy resin-impregnated glass cloth

  • 【发布单位或类别】 JP-JSA日本工业标准调查会
  • 【发布日期】1996-01-01
  • 【CCS分类】
  • 【ICS分类】

SAE ARP1674A

Automated Manufacture of Continuous Multi-Ply Carbon Fiber/Epoxy Resin Impregnated Broadgoods

Automated Manufacture of Continuous Multi-Ply Carbon Fiber/Epoxy Resin Impregnated Broadgoods

  • 【发布单位或类别】 US-SAE美国机动车工程师协会
  • 【发布日期】1988-01-01
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/5C

Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications

Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2020-05-05
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/1D Amendment 3

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2020-03-01
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/1D Amendment 2

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2018-07-11
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/1D Amendment 1

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2018-01-07
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/1C Amendment 2(all prev amd incorp.)

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2013-06-21
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/1D

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2017-06-01
  • 【CCS分类】
  • 【ICS分类】

JIS C 6523:1995

Prepreg for multilayer printed wiring boards -- Modified or unmodified polyimide resin-impregnated glass cloth

Prepreg for multilayer printed wiring boards -- Modified or unmodified polyimide resin-impregnated glass cloth

  • 【发布单位或类别】 JP-JSA日本工业标准调查会
  • 【发布日期】1995-01-01
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/1B Amendment 4(all prev amd incorp.)

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2009-07-04
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/1B Amendment 3

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-through Holes, for Soldered Part Mounting

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-through Holes, for Soldered Part Mounting

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2008-04-15
  • 【CCS分类】
  • 【ICS分类】

JIS C 6524:1995

Prepreg for multilayer printed wiring boards -- Bismaleimide/Triazine/Epoxide resin-Impregnated glass Cloth

Prepreg for multilayer printed wiring boards -- Bismaleimide/Triazine/Epoxide resin-Impregnated glass Cloth

  • 【发布单位或类别】 JP-JSA日本工业标准调查会
  • 【发布日期】1995-01-01
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/1C Amendment 1(amendment incorporated)

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2012-11-01
  • 【CCS分类】
  • 【ICS分类】

北检院部分仪器展示

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