GB/T 6692-2006
Resin finishing agent—Determination of relative density
GB/T 21872-2008
Sulphonic acid hardener for foundry no-bake furan resin
HG/T 3875-2006
Phenol aldehyde amine epoxy resin firming agent
QJ 1708-1989
QJ 2508-1993
T/CPCIF 0351-2024
GB 11115-1989
Low density polyethylene resin
GB/T 15182-1994
Linear low density polyethylene resin
GB 11116-1989
High density polyethylene resin
SAE ARP5144A
Heat Application for Thermosetting Resin Curing
\u0413\u041e\u0421\u0422 \u0420 56211-2014
Uncured epoxy resins. Specification
MIL MIL-R-23461A Notice 1-Validation 1
RESIN COMPOUND, THERMOSETTING, ROOM TEMPERATURE CURING, FOR METAL COATING
T/CAMDI 146-2025
SAE AMS3690D
Adhesive Compound, Epoxy Room Temperature Curing
T/CPCIF 0246-2023
HG/T 2345-1992
T/GAMA 14-2021
JIS K 6941:2019
UV curable resin and thermosetting resin -- Continuous measurement method of shrinkage rate
T/GAMA 27-2023
T/GAMA 28-2023