GB/T 15022.3-2011
Resin based reactive compounds used for electrical insulation - Part 3: Unfilled epoxy resinous compounds
GB/T 15022.5-2011
Resin based reactive compounds used for electrical insulation - Part 5:Quartz filled epoxy resinous compounds
SL/T 807-2021
MIL MIL-PRF-47257F
Compound, Epoxy, Filament Winding
T/CWEA 16-2021
SAE AMS3731C
Potting Compound, Epoxy Bisphenol A-Type
T/CWEA 15-2021
JIS K 6757:2005
Plastics -- Epoxy resins -- Determination of electric conductivity of resin aqueous extracts
BS ISO 21318:2007
Plastics. Epoxy resins. Determination of electrical conductivity of aqueous resin extracts
SAE AMS3731/4C
Potting Compound, Epoxy Bisphenol A-Type Impregnating Resin, Heat Cure, Single Component
MIL MIL-R-81294D Notice 2-Validation 1
REMOVER, PAINT, EPOXY, POLYSULFIDE, AND POLYURETHANE SYSTEMS
T/CEEIA 669-2023
ISO 21318:2007
Plastics — Epoxy resins — Determination of electrical conductivity of aqueous resin extracts
BS 05/30126736 DC
ISO 21318. Plastics. Epoxy resins. Determination of electrical conductivity of aqueous resin extracts
SAE AMS3731/6C
Potting Compound, Epoxy Bisphenol A-Type Syntactic Foam, Heat Cure
ASTM D1726-11(2019)
Standard Test Methods for Hydrolyzable Chloride Content of Liquid Epoxy Resins
SAE AMS3731/5C
Potting Compound, Epoxy Bisphenol A-Type Filled, Room Temperature Cure, Low Exotherm
SAE AMS3731/8C
Potting Compound, Epoxy Bisphenol A-Type Filled, Heat Cure, High HDT
ASTM D4301-05(2019)
Standard Test Method for Total Chlorine in Epoxy Resins and Compounds
SAE AMS3731/10C
Potting Compound, Epoxy, Bisphenol A-Type, Unfilled, Room Temperature Cure, Semiflexible