HG/T 3875-2006
Phenol aldehyde amine epoxy resin firming agent
QJ 2508-1993
T/CPCIF 0351-2024
\u0413\u041e\u0421\u0422 \u0420 56211-2014
Uncured epoxy resins. Specification
SAE AMS3690D
Adhesive Compound, Epoxy Room Temperature Curing
T/CPCIF 0246-2023
BS 11/30211364 DC
BS ISO 14322. Plastics. Epoxy resins. Determination of degree of cure of cured epoxy resins by differential scanning calorimetry
T/HZBX 063-2023
SAE AMS3731/9C
Potting Compound, Epoxy Flexible, Thermal Shock Resistant, Heat Cure
KS M 3821-2008(2023)
Testing methods for specific gravity of epoxide resins and hardeners
SAE AMS3731/4C
Potting Compound, Epoxy Bisphenol A-Type Impregnating Resin, Heat Cure, Single Component
BS EN ISO 4597-1:2008
Plastics. Hardeners and accelerators for epoxy resins-Designation
MIL MIL-R-81903A Notice 2-Validation 2
REMOVER, ACID ACTIVATED, FOR AMINE-CURED EPOXY COATING SYSTEMS
SAE AMS3731/1C
Potting Compound, Epoxy Bisphenol A-Type Unfilled, Room Temperature Cure
KS M 3829-2003(2018)
Testing methods for total amine values of amine-based hardeners of epoxide resins
SAE AMS3731/6C
Potting Compound, Epoxy Bisphenol A-Type Syntactic Foam, Heat Cure
\u0413\u041e\u0421\u0422 10587-84
Uncured epoxy resins. Specifications
\u0413\u041e\u0421\u0422 \u0420 57571-2017
Hardeners for epoxide resins. Determination of primary, secondary and tertiary amine group nitrogen content
SAE AMS3731/3C
Potting Compound, Epoxy Bisphenol A-Type Filled, Heat Cure, Machinable
SAE AMS3731/5C
Potting Compound, Epoxy Bisphenol A-Type Filled, Room Temperature Cure, Low Exotherm