HG/T 6040-2022
KS M 3827-2003(2018)
KS M 3827-2003(2023)
KS C IEC 60455-3-11-2020
Specification for solventless polymerisable resinous compounds used for electrical insulation — Part 3: Specifications for individual materials — Sheet 11: Epoxy resin-based coating powders
BS 5664-3.11:1995
Solventless polymerisable resinous compounds used for electrical insulation. Specification for individual materials-Epoxy resin-based coating powders
SAE AMS1377
Remover, Paint, Epoxy and Polyurethane Paint System, Non-Chlorinated Solvent
UNE 21340-3-11:1993
SPECIFICATION FOR SOLVENTLESS POLYMERISABLE RESINOUS COMPOUNDS USED FOR ELECTRICAL INSULATION. PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS. SHEET 11: EPOXY RESINBASED COATING POWDERS.
GB/T 15022~15023-1994
Solventles polymerisable resinous compounds used for electrical insulation
IEC 60455-3-11:1988
Specification for solventless polymerisable resinous compounds used for electrical insulation. Part 3: Specifications for individual materials. Sheet 11: Epoxy resin-based coating powders
JIS K 7235:1986
Testing methods for non-volatile matter in solvent-diluted epoxide resins
GB/T 15023-1994
Test methods for solventless polymerisable resinous compounds used for electrical insulation
EN 924:2003
KS C 2112-2003(2018)
GB/T 15022-1994
Definitions and general requirements for solventless polymerisable resinous compounds used for electrical insulation
UNE-EN 924:2003
Adhesives - Solvent-borne and solvent-free adhesives - Determination of flashpoint
T/CEEIA 253-2016
JB/T 10109-1999
MIL MIL-I-24718
INSULATING RESINS, SOLVENTLESS, VACUUM-PRESSURE-IMPREGNATING; GENERAL SPECIFICATION FOR
T/ZGM 019-2022
QPL QPL-24092-39
INSULATING VARNISHES AND SOLVENTLESS RESINS FOR APPLICATION BY THE DIP PROCESS (SUPERSEDING QPL-24092-38)