线路板树脂含溴检测标准
CNAS认证
CMA认证
T/CRRA 1309-2023
废线路板制户外树脂固合板
- 【发布单位或类别】 CN-TUANTI团体标准
- 【发布日期】2023-01-06
- 【CCS分类】B70人造板
- 【ICS分类】13.030.01废物综合
T/QYBX 001-2018
电子线路板再生树脂玻纤粉
- 【发布单位或类别】 CN-TUANTI团体标准
- 【发布日期】2018-11-08
- 【CCS分类】M04基础标准和通用方法
- 【ICS分类】83.040.01橡胶和塑料用原料综合
T/SHSE 0003-2021
废线路板干馏处置后含铜产品
- 【发布单位或类别】 CN-TUANTI团体标准
- 【发布日期】2021-12-12
- 【CCS分类】H62重金属及其合金
- 【ICS分类】77.150.30铜产品
KS C 6458-1997(2017)
다층 프린트 배선판용 프리프레그 (유리천 바탕재 에폭시 수지)
Prepreg for multilayer printed wiring boards (Epoxy resin-Impregnated glass cloth)
- 【发布单位或类别】 KR-KS韩国标准
- 【发布日期】1997-08-19
- 【CCS分类】电子元器件与信息技术
- 【ICS分类】31.180印制电路和印制电路板
KS C 6458-1997(2022)
다층 프린트 배선판용 프리프레그 (유리천 바탕재 에폭시 수지)
Prepreg for multilayer printed wiring boards (Epoxy resin-Impregnated glass cloth)
- 【发布单位或类别】 KR-KS韩国标准
- 【发布日期】1997-08-19
- 【CCS分类】
- 【ICS分类】31.180印制电路和印制电路板
T/SGIPA 016-2023
利用废线路板分离的废树脂粉生产塑料母粒技术规程
- 【发布单位或类别】 CN-TUANTI团体标准
- 【发布日期】2023-04-06
- 【CCS分类】L
- 【ICS分类】13.030.01废物综合
MIL MIL-PRF-31032/1D Amendment 3
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2020-03-01
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/1D Amendment 2
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2018-07-11
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/1D Amendment 1
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2018-01-07
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/1C Amendment 2(all prev amd incorp.)
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2013-06-21
- 【CCS分类】
- 【ICS分类】
JIS C 6482:1997
Copper-clad laminates for printed wiring boards -- Paper base, epoxy resin
Copper-clad laminates for printed wiring boards -- Paper base, epoxy resin
- 【发布单位或类别】 JP-JSA日本工业标准调查会
- 【发布日期】1997-01-01
- 【CCS分类】
- 【ICS分类】
JIS C 6522:1996
Prepreg for multilayer printed wiring boards -- Epoxy resin-impregnated glass cloth
Prepreg for multilayer printed wiring boards -- Epoxy resin-impregnated glass cloth
- 【发布单位或类别】 JP-JSA日本工业标准调查会
- 【发布日期】1996-01-01
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/1B Amendment 4(all prev amd incorp.)
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2009-07-04
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/1B Amendment 3
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2008-04-15
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/1D
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2017-06-01
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/2D
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2020-03-02
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/6C
Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2020-05-06
- 【CCS分类】
- 【ICS分类】
JIS C 6483:1997
Copper-clad laminates for printed wiring boards -- Synthetic fiber fabric base, epoxy resin
Copper-clad laminates for printed wiring boards -- Synthetic fiber fabric base, epoxy resin
- 【发布单位或类别】 JP-JSA日本工业标准调查会
- 【发布日期】1997-01-01
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/5C
Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications
Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2020-05-05
- 【CCS分类】
- 【ICS分类】
MIL MIL-PRF-31032/6 Amendment 1(amendment incorporated)
Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications
- 【发布单位或类别】 US-MIL美国军事规范和标准
- 【发布日期】2009-04-10
- 【CCS分类】
- 【ICS分类】
