机构简介
北检(北京)检测技术研究院(简称：北检院)，依托科研测试与材料检测重点领域，结合“211工程”和“985工程”建设，面向学校和社会企业开放的仪器共享机构和跨学科检测交叉融合平台。面向企业及科研单位跨学科研究、面向社会公共服务，构建具有装备优势、人才优势和服务优势的综合科研检测服务平台。 了解更多 +
仪器展示
塑料检测
橡胶检测
高分子材料检测
纺织品检测
建筑材料检测
金属材料检测
生物领域检测
动物领域检测
非标试验
植物领域检测
矿石检测
油品检测
热门检测
最新检测
最新检测
热门检测
检测标准

线路板树脂含溴检测标准

发布时间：2025-02-14 01:12:00 点击数：0
在线咨询

T/CRRA 1309-2023

废线路板制户外树脂固合板

  • 【发布单位或类别】 CN-TUANTI团体标准
  • 【发布日期】2023-01-06
  • 【CCS分类】B70人造板
  • 【ICS分类】13.030.01废物综合

T/QYBX 001-2018

电子线路板再生树脂玻纤粉

  • 【发布单位或类别】 CN-TUANTI团体标准
  • 【发布日期】2018-11-08
  • 【CCS分类】M04基础标准和通用方法
  • 【ICS分类】83.040.01橡胶和塑料用原料综合

T/SHSE 0003-2021

废线路板干馏处置后含铜产品

  • 【发布单位或类别】 CN-TUANTI团体标准
  • 【发布日期】2021-12-12
  • 【CCS分类】H62重金属及其合金
  • 【ICS分类】77.150.30铜产品

KS C 6458-1997(2017)

다층 프린트 배선판용 프리프레그 (유리천 바탕재 에폭시 수지)

Prepreg for multilayer printed wiring boards (Epoxy resin-Impregnated glass cloth)

  • 【发布单位或类别】 KR-KS韩国标准
  • 【发布日期】1997-08-19
  • 【CCS分类】电子元器件与信息技术
  • 【ICS分类】31.180印制电路和印制电路板

KS C 6458-1997(2022)

다층 프린트 배선판용 프리프레그 (유리천 바탕재 에폭시 수지)

Prepreg for multilayer printed wiring boards (Epoxy resin-Impregnated glass cloth)

  • 【发布单位或类别】 KR-KS韩国标准
  • 【发布日期】1997-08-19
  • 【CCS分类】
  • 【ICS分类】31.180印制电路和印制电路板

T/SGIPA 016-2023

利用废线路板分离的废树脂粉生产塑料母粒技术规程

  • 【发布单位或类别】 CN-TUANTI团体标准
  • 【发布日期】2023-04-06
  • 【CCS分类】L
  • 【ICS分类】13.030.01废物综合

MIL MIL-PRF-31032/1D Amendment 3

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2020-03-01
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/1D Amendment 2

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2018-07-11
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/1D Amendment 1

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2018-01-07
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/1C Amendment 2(all prev amd incorp.)

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2013-06-21
  • 【CCS分类】
  • 【ICS分类】

JIS C 6482:1997

Copper-clad laminates for printed wiring boards -- Paper base, epoxy resin

Copper-clad laminates for printed wiring boards -- Paper base, epoxy resin

  • 【发布单位或类别】 JP-JSA日本工业标准调查会
  • 【发布日期】1997-01-01
  • 【CCS分类】
  • 【ICS分类】

JIS C 6522:1996

Prepreg for multilayer printed wiring boards -- Epoxy resin-impregnated glass cloth

Prepreg for multilayer printed wiring boards -- Epoxy resin-impregnated glass cloth

  • 【发布单位或类别】 JP-JSA日本工业标准调查会
  • 【发布日期】1996-01-01
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/1B Amendment 4(all prev amd incorp.)

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2009-07-04
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/1B Amendment 3

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-through Holes, for Soldered Part Mounting

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-through Holes, for Soldered Part Mounting

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2008-04-15
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/1D

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

Printed Wiring Board, Rigid, Multilayered, Thermosetting Resin Base Material, with or without Blind and Buried Plated-Through Holes, for Soldered Part Mounting

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2017-06-01
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/2D

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting

Printed Wiring Board, Rigid, Single and Double Layer, Thermosetting Resin Base Material, with or without Plated-through Holes, for Soldered Part Mounting

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2020-03-02
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/6C

Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications

Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2020-05-06
  • 【CCS分类】
  • 【ICS分类】

JIS C 6483:1997

Copper-clad laminates for printed wiring boards -- Synthetic fiber fabric base, epoxy resin

Copper-clad laminates for printed wiring boards -- Synthetic fiber fabric base, epoxy resin

  • 【发布单位或类别】 JP-JSA日本工业标准调查会
  • 【发布日期】1997-01-01
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/5C

Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications

Printed Wiring Board, Rigid, Multilayered, Thermoplastic, Thermosetting, or Thermoplastic and Thermosetting Resin Base Material, with Plated Through Holes, for High Frequency Applications

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2020-05-05
  • 【CCS分类】
  • 【ICS分类】

MIL MIL-PRF-31032/6 Amendment 1(amendment incorporated)

Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications

Printed Wiring Board, Rigid, Single and Double Sided, Thermoplastic Resin Base Material, with or without Plated-Through Holes, for High Frequency Applications

  • 【发布单位或类别】 US-MIL美国军事规范和标准
  • 【发布日期】2009-04-10
  • 【CCS分类】
  • 【ICS分类】

北检院部分仪器展示

北检仪器展示 北检仪器展示 北检仪器展示 北检仪器展示